Intel Corporation
5SGXEA3H2F35C3N
5SGXEA3H2F35C3N ECAD Model
5SGXEA3H2F35C3N Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | Intel | |
| Series | Stratix® V GX | |
| Package | Tray | |
| Number of LABs/CLBs | 128300 | |
| Number of Logic Elements/Cells | 340000 | |
| Total RAM Bits | 19456000 | |
| Number of I/O | 432 | |
| Voltage - Supply | 0.82V ~ 0.88V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 1152-BBGA, FCBGA | |
| Supplier Device Package | 1152-FBGA (35x35) | |
| Base Product Number | 5SGXEA3 |
5SGXEA3H2F35C3N Datasheet Download
5SGXEA3H2F35C3N Overview
The chip model 5SGXEA3H2F35C3N is a powerful and versatile integrated circuit (IC) designed for high-performance digital signal processing, embedded processing, image processing, and other related applications. It is based on the Stratix 10 SX FPGA architecture, which is optimized for high-speed, low-power operation. This chip model is equipped with an advanced memory hierarchy, high-speed transceivers, and a wide variety of I/O interfaces. It also supports the use of HDL (Hardware Description Language) programming, which makes it suitable for a wide range of applications.
The 5SGXEA3H2F35C3N chip model is designed to provide superior performance, scalability, and flexibility for a variety of applications. It is designed to be highly reliable, with a wide range of features to support a variety of applications. This chip model has the ability to support up to three levels of memory hierarchy, high-speed transceivers, and a wide variety of I/O interfaces. It also supports the use of HDL programming, which makes it suitable for a wide variety of applications.
The 5SGXEA3H2F35C3N chip model is expected to experience high demand in the future due to its superior performance and scalability. It is well-suited for use in embedded systems, high-performance digital signal processing, image processing, and other related applications. It is also expected to be used in advanced communication systems due to its high-speed transceivers and wide variety of I/O interfaces.
The original design intention of the chip model 5SGXEA3H2F35C3N was to provide superior performance, scalability, and flexibility for a variety of applications. It is also designed to be highly reliable, with a wide range of features to support a variety of applications. The chip model is designed to be upgradable, with the possibility of future upgrades and enhancements. This chip model is also capable of being used in advanced communication systems, due to its high-speed transceivers and wide variety of I/O interfaces. As such, it is expected to be in high demand in the future.
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3,315 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,425.4452 | $2,425.4452 |
| 10+ | $2,399.3652 | $23,993.6515 |
| 100+ | $2,268.9649 | $226,896.4872 |
| 1000+ | $2,138.5646 | $1,069,282.2960 |
| 10000+ | $1,956.0042 | $1,956,004.2000 |
| The price is for reference only, please refer to the actual quotation! | ||