5SGXEA3H2F35C1N
5SGXEA3H2F35C1N
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Intel Corporation

5SGXEA3H2F35C1N


5SGXEA3H2F35C1N
F18-5SGXEA3H2F35C1N
Active
IC FPGA 432 I/O 1152FBGA
1152-FBGA (35x35)

5SGXEA3H2F35C1N ECAD Model


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5SGXEA3H2F35C1N Attributes


Type Description Select
Mfr Intel
Series Stratix® V GX
Package Tray
Number of LABs/CLBs 128300
Number of Logic Elements/Cells 340000
Total RAM Bits 19456000
Number of I/O 432
Voltage - Supply 0.87V ~ 0.93V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number 5SGXEA3

5SGXEA3H2F35C1N Datasheet Download


5SGXEA3H2F35C1N Overview



The chip model 5SGXEA3H2F35C1N is an important part of the current semiconductor industry. It is an advanced and powerful chip that has been widely used in the current market. It is a perfect combination of high-performance, low-power and low-cost features. It has been widely used in many industries such as consumer electronics, communications, and automotive.


The original design intention of the chip model 5SGXEA3H2F35C1N was to meet the needs of the current market. It is designed to be a powerful, low-cost and low-power chip, and it can be used to meet the needs of different industries. It can also be used in the development of advanced communication systems and intelligent robots.


As the industry trends of the chip model 5SGXEA3H2F35C1N and the future development of related industries, it is necessary to consider whether the application environment requires the support of new technologies. It is important to determine what specific technologies are needed to make the chip model 5SGXEA3H2F35C1N more powerful and efficient. For example, the chip model 5SGXEA3H2F35C1N can be used in the development of advanced communication systems, such as 5G, which requires the support of advanced technologies such as AI and IoT.


In order to make the chip model 5SGXEA3H2F35C1N more powerful and efficient, it is necessary to consider the possibility of future upgrades. It is important to determine whether the chip model 5SGXEA3H2F35C1N can be upgraded to support new technologies and applications. For example, the chip model 5SGXEA3H2F35C1N can be upgraded to support the development and popularization of future intelligent robots, which require the support of advanced technologies such as AI, deep learning, and machine learning.


In order to use the chip model 5SGXEA3H2F35C1N effectively, it is important to have the right technical talents. The technical talents should be familiar with the chip model 5SGXEA3H2F35C1N and its related technologies. They should also be able to use the chip model 5SGXEA3H2F35C1N to develop advanced communication systems and intelligent robots.


In conclusion, the chip model 5SGXEA3H2F35C1N is an important part of the current semiconductor industry. It is an advanced and powerful chip that has been widely used in the current market. It is necessary to consider whether the application environment requires the support of new technologies, the possibility of future upgrades, and the right technical talents to use the chip model 5SGXEA3H2F35C1N effectively. By doing so, the chip model 5SGXEA3H2F35C1N can be used to develop advanced communication systems and intelligent robots.



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