Intel Corporation
5SGXEA3H1F35C1N
5SGXEA3H1F35C1N ECAD Model
5SGXEA3H1F35C1N Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | Intel | |
| Series | Stratix® V GX | |
| Package | Tray | |
| Number of LABs/CLBs | 128300 | |
| Number of Logic Elements/Cells | 340000 | |
| Total RAM Bits | 19456000 | |
| Number of I/O | 432 | |
| Voltage - Supply | 0.87V ~ 0.93V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 1152-BBGA, FCBGA | |
| Supplier Device Package | 1152-FBGA (35x35) | |
| Base Product Number | 5SGXEA3 |
5SGXEA3H1F35C1N Datasheet Download
5SGXEA3H1F35C1N Overview
The chip model 5SGXEA3H1F35C1N is a highly advanced and reliable chip model that has been designed for a wide range of applications. It is a low-power, low-cost, and high-performance solution for embedded applications. The chip model is based on the Altera Stratix V FPGA, which is a highly advanced and reliable FPGA platform. The chip model is designed to provide high-performance and efficient solutions for embedded applications.
The chip model 5SGXEA3H1F35C1N is designed to provide a wide range of features and capabilities. It includes a high-speed transceiver, a low-power core, and an advanced communication system. The chip model is designed to provide an efficient and reliable solution for embedded applications. The chip model is designed to provide a wide range of features and capabilities, including a high-speed transceiver, a low-power core, and an advanced communication system.
The chip model 5SGXEA3H1F35C1N is designed to provide a wide range of features and capabilities. It includes a high-speed transceiver, a low-power core, and an advanced communication system. The chip model is designed to provide an efficient and reliable solution for embedded applications. It is designed to provide high-performance and efficient solutions for embedded applications. The chip model is designed to provide a wide range of features and capabilities, including a high-speed transceiver, a low-power core, and an advanced communication system.
The chip model 5SGXEA3H1F35C1N is designed to provide a wide range of features and capabilities. It includes a high-speed transceiver, a low-power core, and an advanced communication system. The chip model is designed to provide an efficient and reliable solution for embedded applications. It is designed to provide high-performance and efficient solutions for embedded applications. The chip model is designed to provide a wide range of features and capabilities, including a high-speed transceiver, a low-power core, and an advanced communication system.
In terms of industry trends, the chip model 5SGXEA3H1F35C1N is designed to provide a wide range of features and capabilities. It is designed to provide high-performance and efficient solutions for embedded applications. It is designed to provide a wide range of features and capabilities, including a high-speed transceiver, a low-power core, and an advanced communication system. The chip model is designed to provide an efficient and reliable solution for embedded applications.
The original design intention of the chip model 5SGXEA3H1F35C1N was to provide a high-performance and efficient solution for embedded applications. It is designed to provide a wide range of features and capabilities, including a high-speed transceiver, a low-power core, and an advanced communication system. The chip model is designed to provide an efficient and reliable solution for embedded applications.
In terms of future upgrades, the chip model 5SGXEA3H1F35C1N is designed to provide a wide range of features and capabilities. It is designed to provide an efficient and reliable solution for embedded applications. The chip model is designed to provide a wide range of features and capabilities, including a high-speed transceiver, a low-power core, and an advanced communication system. The chip model is designed to provide high-performance and efficient solutions for embedded applications.
The chip model 5SGXEA3H1F35C1N is designed to support advanced communication systems. It is designed to provide a wide range of features and capabilities, including a high-speed transceiver, a low-power core, and an advanced communication system. The chip model is designed to provide an efficient and reliable solution for embedded applications.
The product description of the chip model 5SGXEA3H1F35C1N includes a wide range of features and capabilities. It includes a high-speed transceiver, a low-power core, and an advanced communication system. The chip model is designed to provide an efficient and reliable solution for embedded applications. It is designed to provide high-performance and efficient solutions for embedded applications.
The specific design requirements of the chip model 5SGXEA3H1F35C1N include the following: high-speed transceiver, low-power core, advanced communication system, and efficient and reliable solution for embedded applications. In addition, the chip model is designed to provide a wide range of features and capabilities, including a high-speed transceiver, a low-power core, and an advanced communication system.
Case studies and precautions should be taken when using the chip model 5SGXEA3H1F35C1N. It is important to ensure that the chip model is properly installed and configured to ensure that it is working properly. It is also important to ensure that the chip model is compatible with
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2,957 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,943.9705 | $3,943.9705 |
| 10+ | $3,901.5622 | $39,015.6220 |
| 100+ | $3,689.5208 | $368,952.0778 |
| 1000+ | $3,477.4794 | $1,738,739.6768 |
| 10000+ | $3,180.6214 | $3,180,621.3600 |
| The price is for reference only, please refer to the actual quotation! | ||