
Intel Corporation
5SGTMC7K3F40I2
5SGTMC7K3F40I2 ECAD Model
5SGTMC7K3F40I2 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 600 | |
Number of Outputs | 600 | |
Number of Logic Cells | 622000 | |
Number of CLBs | 23472 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 23472 CLBS | |
Power Supplies | 0.9,1.5,2.5,2.5/3,1.2/3 V | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1517 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
5SGTMC7K3F40I2 Datasheet Download
5SGTMC7K3F40I2 Overview
Chip model 5SGTMC7K3F40I2 is part of a family of advanced, low-power, high-performance, and cost-effective System-on-Chip (SoC) solutions designed for a variety of applications. It is an ideal choice for applications requiring a combination of high performance and low power consumption. This SoC solution is based on a 32-bit ARM Cortex-M7 processor core and is integrated with multiple peripherals and interfaces, making it an ideal choice for embedded applications.
The chip model 5SGTMC7K3F40I2 is suitable for a wide range of applications, including industrial automation, home automation, medical, automotive, and consumer electronics. It offers a high level of performance and low power consumption, making it an ideal solution for embedded applications. It also provides a high level of integration, reducing the need for external components and enabling smaller product footprints.
The chip model 5SGTMC7K3F40I2 has a number of features that make it attractive to developers. It supports a wide range of peripherals, including GPIO, ADC, PWM, I2C, SPI, and UART. It also supports a wide range of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee. The chip model 5SGTMC7K3F40I2 also supports a wide range of operating systems, including Linux, Android, and FreeRTOS.
The chip model 5SGTMC7K3F40I2 is expected to be in high demand in the future due to its high performance, low power consumption, and high level of integration. Its wide range of features and support for a variety of operating systems make it an ideal solution for a variety of embedded applications.
When designing with the chip model 5SGTMC7K3F40I2, it is important to consider the specific requirements of the application. The design should take into account the required peripherals, communication protocols, operating systems, and power consumption. It is also important to consider the support of any new technologies that may be needed for the application environment.
For example, if the application requires Wi-Fi connectivity, the design should include the necessary components to support Wi-Fi. Similarly, if the application requires Bluetooth, the design should include the necessary components to support Bluetooth. Additionally, if the application requires support for a specific operating system, the design should include the necessary components to support that operating system.
In conclusion, the chip model 5SGTMC7K3F40I2 is a high-performance, low-power, and cost-effective SoC solution that is suitable for a wide range of embedded applications. It offers a high level of performance, low power consumption, and high level of integration, making it an ideal solution for embedded applications. When designing with the chip model 5SGTMC7K3F40I2, it is important to consider the specific requirements of the application, including the support of any new technologies that may be needed for the application environment.
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