5SGTMC7K3F40I2
5SGTMC7K3F40I2
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rohs

Intel Corporation

5SGTMC7K3F40I2


5SGTMC7K3F40I2
F18-5SGTMC7K3F40I2
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1517
FBGA-1517

5SGTMC7K3F40I2 ECAD Model


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5SGTMC7K3F40I2 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 622000
Number of CLBs 23472
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 23472 CLBS
Power Supplies 0.9,1.5,2.5,2.5/3,1.2/3 V
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1517
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1517
Reach Compliance Code compliant
HTS Code 8542.39.00.01

5SGTMC7K3F40I2 Datasheet Download


5SGTMC7K3F40I2 Overview



Chip model 5SGTMC7K3F40I2 is part of a family of advanced, low-power, high-performance, and cost-effective System-on-Chip (SoC) solutions designed for a variety of applications. It is an ideal choice for applications requiring a combination of high performance and low power consumption. This SoC solution is based on a 32-bit ARM Cortex-M7 processor core and is integrated with multiple peripherals and interfaces, making it an ideal choice for embedded applications.


The chip model 5SGTMC7K3F40I2 is suitable for a wide range of applications, including industrial automation, home automation, medical, automotive, and consumer electronics. It offers a high level of performance and low power consumption, making it an ideal solution for embedded applications. It also provides a high level of integration, reducing the need for external components and enabling smaller product footprints.


The chip model 5SGTMC7K3F40I2 has a number of features that make it attractive to developers. It supports a wide range of peripherals, including GPIO, ADC, PWM, I2C, SPI, and UART. It also supports a wide range of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee. The chip model 5SGTMC7K3F40I2 also supports a wide range of operating systems, including Linux, Android, and FreeRTOS.


The chip model 5SGTMC7K3F40I2 is expected to be in high demand in the future due to its high performance, low power consumption, and high level of integration. Its wide range of features and support for a variety of operating systems make it an ideal solution for a variety of embedded applications.


When designing with the chip model 5SGTMC7K3F40I2, it is important to consider the specific requirements of the application. The design should take into account the required peripherals, communication protocols, operating systems, and power consumption. It is also important to consider the support of any new technologies that may be needed for the application environment.


For example, if the application requires Wi-Fi connectivity, the design should include the necessary components to support Wi-Fi. Similarly, if the application requires Bluetooth, the design should include the necessary components to support Bluetooth. Additionally, if the application requires support for a specific operating system, the design should include the necessary components to support that operating system.


In conclusion, the chip model 5SGTMC7K3F40I2 is a high-performance, low-power, and cost-effective SoC solution that is suitable for a wide range of embedded applications. It offers a high level of performance, low power consumption, and high level of integration, making it an ideal solution for embedded applications. When designing with the chip model 5SGTMC7K3F40I2, it is important to consider the specific requirements of the application, including the support of any new technologies that may be needed for the application environment.



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