
Intel Corporation
5SGTMC5K3F40I3
5SGTMC5K3F40I3 ECAD Model
5SGTMC5K3F40I3 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 850 mV | |
Surface Mount | YES | |
Power Supplies | 0.85,1.5,2.5,2.5/3,1.2/3 V | |
Supply Voltage-Max | 880 mV | |
Supply Voltage-Min | 820 mV | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Length | 40 mm | |
Seated Height-Max | 3.5 mm | |
Width | 40 mm | |
Ihs Manufacturer | INTEL CORP | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Package Description | FBGA-1517 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Number of CLBs | 16040 | |
Number of Inputs | 600 | |
Number of Logic Cells | 425000 | |
Number of Outputs | 600 | |
Organization | 16040 CLBS |
5SGTMC5K3F40I3 Datasheet Download
5SGTMC5K3F40I3 Overview
The 5SGTMC5K3F40I3 chip model is a highly advanced semiconductor component designed to meet the needs of modern communication systems. Developed by the well-known semiconductor manufacturer, GlobalFoundries, the 5SGTMC5K3F40I3 is a powerful and reliable chip that offers a wide range of features and capabilities. It is a single-chip solution that integrates multiple functions, including high-speed data processing, advanced signal processing, and high-performance memory.
The original design intention of the 5SGTMC5K3F40I3 was to provide a highly efficient and reliable solution for communication systems. It is designed to provide the highest performance while maintaining a low power consumption. The chip is also designed with a high degree of scalability, making it easy to upgrade and adapt to new communications technologies. This makes the 5SGTMC5K3F40I3 a great choice for use in advanced communication systems.
The 5SGTMC5K3F40I3 is also well-suited for use in networks and intelligent scenarios. Its high-speed data processing capabilities make it ideal for use in networks that require fast data transfer and processing. It is also capable of performing complex signal processing tasks, making it a great choice for intelligent systems. With its powerful memory, the 5SGTMC5K3F40I3 can store large amounts of data and provide quick access to it.
The 5SGTMC5K3F40I3 is also a great choice for use in the development and popularization of future intelligent robots. Its powerful processing capabilities, combined with its low power consumption, make it an ideal choice for use in robots. Additionally, its scalability allows for easy upgrades and adaptations to new technologies. To use the 5SGTMC5K3F40I3 effectively, technical talents such as engineers, computer scientists, and software developers are needed.
In conclusion, the 5SGTMC5K3F40I3 chip model is a powerful and reliable solution for communication systems. It is designed with a high degree of scalability, making it easy to upgrade and adapt to new technologies. It is also well-suited for use in networks and intelligent scenarios, as well as the development and popularization of future intelligent robots. To use the 5SGTMC5K3F40I3 effectively, technical talents such as engineers, computer scientists, and software developers are needed.
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