
Intel Corporation
5SGSMD5K3F40C2
5SGSMD5K3F40C2 ECAD Model
5SGSMD5K3F40C2 Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® V GS | |
Package | Tray | |
Number of LABs/CLBs | 172600 | |
Number of Logic Elements/Cells | 457000 | |
Total RAM Bits | 39936000 | |
Number of I/O | 696 | |
Voltage - Supply | 0.87V ~ 0.93V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 1517-BBGA, FCBGA | |
Supplier Device Package | 1517-FBGA (40x40) | |
Base Product Number | 5SGSMD5 |
5SGSMD5K3F40C2 Datasheet Download
5SGSMD5K3F40C2 Overview
The chip model 5SGSMD5K3F40C2 is a high-performance digital signal processor (DSP) designed for embedded processing, image processing, and other applications requiring the use of HDL language. It is a highly efficient chip that is capable of achieving high performance while consuming minimal power. This makes it ideal for applications such as high-end digital signal processing and embedded processing.
The chip model 5SGSMD5K3F40C2 has several advantages that make it attractive to those in the industry. First, its small size and low power consumption make it suitable for applications where space and power are at a premium. Second, its high performance and low latency make it suitable for applications that require high throughput and low latency. Third, it is easy to program and debug, making it suitable for rapid prototyping and development.
The original design intention of the chip model 5SGSMD5K3F40C2 was to provide a powerful and efficient solution for embedded processing and image processing. As such, it is expected to remain in high demand in the coming years, as more and more industries look to utilize the chip's capabilities. Furthermore, the chip model 5SGSMD5K3F40C2 has the potential to be upgraded to support advanced communication systems in the future, as it is capable of handling the increased throughput and latency that such systems require. This means that the chip model 5SGSMD5K3F40C2 could be used to power the next generation of communication systems, making it a highly sought-after chip in the industry.
Overall, the chip model 5SGSMD5K3F40C2 is an excellent choice for those looking for powerful and efficient solutions for embedded processing and image processing. Its small size and low power consumption make it ideal for applications where space and power are at a premium, while its high performance and low latency make it suitable for applications that require high throughput and low latency. Furthermore, its potential to be upgraded to support advanced communication systems in the future makes it a highly desirable chip in the industry.
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