Intel Corporation
5SGSMD5H2F35C3N
5SGSMD5H2F35C3N ECAD Model
5SGSMD5H2F35C3N Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | Intel | |
| Series | Stratix® V GS | |
| Package | Tray | |
| Number of LABs/CLBs | 172600 | |
| Number of Logic Elements/Cells | 457000 | |
| Total RAM Bits | 39936000 | |
| Number of I/O | 552 | |
| Voltage - Supply | 0.82V ~ 0.88V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 1152-BBGA, FCBGA | |
| Supplier Device Package | 1152-FBGA (35x35) | |
| Base Product Number | 5SGSMD5 |
5SGSMD5H2F35C3N Datasheet Download
5SGSMD5H2F35C3N Overview
The 5SGSMD5H2F35C3N chip model is a new generation of semiconductor device that has been designed to meet the ever-increasing demands of modern communication systems. It is a highly advanced chip model that combines the latest in semiconductor technology with the latest in communication system design. This chip model has a number of advantages that make it a very attractive choice for use in communication systems.
To begin with, this chip model is designed to be extremely power efficient. It has been designed to consume very little power, making it an ideal choice for use in mobile communication systems. Additionally, it has been designed to be highly reliable and robust, making it suitable for use in a wide variety of communication systems. Furthermore, this chip model has been designed to be highly compatible with a range of communication systems, allowing for easy integration into existing systems.
In terms of its expected demand trends in related industries, it is likely that the 5SGSMD5H2F35C3N chip model will continue to be popular in the future. This is due to its power efficiency, reliability, and compatibility with existing communication systems. Additionally, it is likely that the demand for this chip model will continue to increase as more communication systems are developed and deployed.
The original design intention of the 5SGSMD5H2F35C3N chip model was to provide a highly advanced and efficient solution for communication systems. It has been designed to be extremely power efficient, reliable, and compatible with existing communication systems. Additionally, this chip model has been designed to be upgradeable, allowing for the integration of new technologies and features as they become available. This makes it a very attractive choice for use in communication systems.
The 5SGSMD5H2F35C3N chip model is also likely to be used in advanced communication systems in the future. This is due to its power efficiency and compatibility with existing communication systems. Additionally, it is likely to be used in networks and intelligent scenarios as the technology advances and the need for more advanced communication systems increases. This chip model is likely to be an important part of the future of communication systems and could be used in the era of fully intelligent systems.
Overall, the 5SGSMD5H2F35C3N chip model is a highly advanced and efficient chip model that is designed to meet the demands of modern communication systems. It is power efficient, reliable, and upgradeable, making it an attractive choice for use in communication systems. Additionally, it is likely to be used in advanced communication systems in the future, and could be used in networks and intelligent scenarios. This chip model is likely to be an important part of the future of communication systems and could be used in the era of fully intelligent systems.
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2,911 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,879.1870 | $4,879.1870 |
| 10+ | $4,826.7226 | $48,267.2259 |
| 100+ | $4,564.4007 | $456,440.0712 |
| 1000+ | $4,302.0788 | $2,151,039.4160 |
| 10000+ | $3,934.8282 | $3,934,828.2000 |
| The price is for reference only, please refer to the actual quotation! | ||