5SGSMD4E2H29C2N
5SGSMD4E2H29C2N
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Intel Corporation

5SGSMD4E2H29C2N


5SGSMD4E2H29C2N
F18-5SGSMD4E2H29C2N
Active
IC FPGA 360 I/O 780HBGA
780-HBGA (33x33)

5SGSMD4E2H29C2N ECAD Model


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5SGSMD4E2H29C2N Attributes


Type Description Select
Mfr Intel
Series Stratix® V GS
Package Tray
Number of LABs/CLBs 135840
Number of Logic Elements/Cells 360000
Total RAM Bits 19456000
Number of I/O 360
Voltage - Supply 0.87V ~ 0.93V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-HBGA (33x33)
Base Product Number 5SGSMD4

5SGSMD4E2H29C2N Datasheet Download


5SGSMD4E2H29C2N Overview



The chip model 5SGSMD4E2H29C2N is the latest development in the field of semiconductor technology. It is designed to provide improved performance and enhanced capabilities for a wide range of applications. It is a highly integrated device that can be used in a variety of communication systems, such as cellular, wireless, and satellite. It is also capable of supporting advanced technologies, such as 5G, IoT, and AI.


The chip model 5SGSMD4E2H29C2N is designed to be a highly efficient and reliable solution for modern communication systems. It is equipped with a variety of features, such as high speed data transfer, low power consumption, and a high level of integration. It is designed to be compatible with a wide range of communication protocols and standards, such as LTE, Wi-Fi, and Bluetooth. It is also capable of supporting advanced technologies, such as 5G, IoT, and AI.


The chip model 5SGSMD4E2H29C2N is designed to be a cost-effective solution for modern communication systems. Its low power consumption and high integration make it an ideal choice for applications that require high performance without sacrificing power efficiency. It is also capable of supporting advanced technologies, such as 5G, IoT, and AI.


The chip model 5SGSMD4E2H29C2N has the potential to be used in a variety of intelligent scenarios. It is capable of supporting a wide range of communication protocols and standards, such as LTE, Wi-Fi, and Bluetooth. It is also able to support advanced technologies, such as 5G, IoT, and AI. This makes it an ideal choice for applications in networks, such as smart homes, smart cities, and autonomous vehicles.


The chip model 5SGSMD4E2H29C2N is designed to be a highly efficient and reliable solution for modern communication systems. It is capable of supporting advanced technologies, such as 5G, IoT, and AI. This makes it an ideal choice for applications in the era of fully intelligent systems. It is also capable of supporting a wide range of communication protocols and standards, such as LTE, Wi-Fi, and Bluetooth.


In conclusion, the chip model 5SGSMD4E2H29C2N is a highly advanced and reliable solution for modern communication systems. It is capable of supporting advanced technologies, such as 5G, IoT, and AI. It is also capable of supporting a wide range of communication protocols and standards, such as LTE, Wi-Fi, and Bluetooth. This makes it an ideal choice for applications in networks, such as smart homes, smart cities, and autonomous vehicles. It is also capable of being used in the era of fully intelligent systems.



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