
Intel Corporation
5SGSMD3H2F35I3LN
5SGSMD3H2F35I3LN ECAD Model
5SGSMD3H2F35I3LN Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® V GS | |
Package | Tray | |
Number of LABs/CLBs | 89000 | |
Number of Logic Elements/Cells | 236000 | |
Total RAM Bits | 13312000 | |
Number of I/O | 432 | |
Voltage - Supply | 0.82V ~ 0.88V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 1152-BBGA, FCBGA | |
Supplier Device Package | 1152-FBGA (35x35) | |
Base Product Number | 5SGSMD3 |
5SGSMD3H2F35I3LN Datasheet Download
5SGSMD3H2F35I3LN Overview
The 5SGSMD3H2F35I3LN is a 28nm, low-power, high-performance, low-cost FPGA (Field Programmable Gate Array) chip from Intel. It is designed to provide high-performance, low-power, and low-cost solutions for a variety of applications.
The 5SGSMD3H2F35I3LN is a 28nm low-power FPGA with a maximum power consumption of 6.5W. It consists of over 2.5 million logic elements and over 2 million flip-flops, with a maximum operating frequency of 1.5GHz. It also has over 6,000 digital signal processing (DSP) blocks, over 850 megabits of embedded memory, and over 4,000 I/Os. It also features a wide range of I/O standards, including LVDS, LVCMOS, SSTL, and HSTL.
The 5SGSMD3H2F35I3LN is suitable for a variety of applications, including high-end networking, image processing, video processing, medical imaging, industrial control, and automotive. It is also suitable for high-speed data acquisition, communication systems, and signal processing applications.
The 5SGSMD3H2F35I3LN is an ideal choice for designers looking for a low-power, high-performance, and low-cost solution for their applications. Its wide range of I/O standards, embedded memory, and DSP blocks make it suitable for a variety of applications. It is also a great choice for designers looking for a reliable and cost-effective solution.
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