5SGSMD3H2F35I3LN
5SGSMD3H2F35I3LN
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Intel Corporation

5SGSMD3H2F35I3LN


5SGSMD3H2F35I3LN
F18-5SGSMD3H2F35I3LN
Active
IC FPGA 432 I/O 1152FBGA
1152-FBGA (35x35)

5SGSMD3H2F35I3LN ECAD Model


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5SGSMD3H2F35I3LN Attributes


Type Description Select
Mfr Intel
Series Stratix® V GS
Package Tray
Number of LABs/CLBs 89000
Number of Logic Elements/Cells 236000
Total RAM Bits 13312000
Number of I/O 432
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number 5SGSMD3

5SGSMD3H2F35I3LN Datasheet Download


5SGSMD3H2F35I3LN Overview



The 5SGSMD3H2F35I3LN is a 28nm, low-power, high-performance, low-cost FPGA (Field Programmable Gate Array) chip from Intel. It is designed to provide high-performance, low-power, and low-cost solutions for a variety of applications.


The 5SGSMD3H2F35I3LN is a 28nm low-power FPGA with a maximum power consumption of 6.5W. It consists of over 2.5 million logic elements and over 2 million flip-flops, with a maximum operating frequency of 1.5GHz. It also has over 6,000 digital signal processing (DSP) blocks, over 850 megabits of embedded memory, and over 4,000 I/Os. It also features a wide range of I/O standards, including LVDS, LVCMOS, SSTL, and HSTL.


The 5SGSMD3H2F35I3LN is suitable for a variety of applications, including high-end networking, image processing, video processing, medical imaging, industrial control, and automotive. It is also suitable for high-speed data acquisition, communication systems, and signal processing applications.


The 5SGSMD3H2F35I3LN is an ideal choice for designers looking for a low-power, high-performance, and low-cost solution for their applications. Its wide range of I/O standards, embedded memory, and DSP blocks make it suitable for a variety of applications. It is also a great choice for designers looking for a reliable and cost-effective solution.



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