Intel Corporation
5SGSMD3H2F35I2N
5SGSMD3H2F35I2N ECAD Model
5SGSMD3H2F35I2N Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | Intel | |
| Series | Stratix® V GS | |
| Package | Tray | |
| Number of LABs/CLBs | 89000 | |
| Number of Logic Elements/Cells | 236000 | |
| Total RAM Bits | 13312000 | |
| Number of I/O | 432 | |
| Voltage - Supply | 0.87V ~ 0.93V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C (TJ) | |
| Package / Case | 1152-BBGA, FCBGA | |
| Supplier Device Package | 1152-FBGA (35x35) | |
| Base Product Number | 5SGSMD3 |
5SGSMD3H2F35I2N Datasheet Download
5SGSMD3H2F35I2N Overview
The chip model 5SGSMD3H2F35I2N is a semiconductor device that has been developed to meet the demands of modern technology. It is designed to provide high-performance, low-power solutions for a wide range of applications. It is a versatile and reliable chip that is used in many different industries, including communications, automotive, and industrial applications.
The chip model 5SGSMD3H2F35I2N is designed to be highly efficient and reliable. It has a low power consumption, which makes it suitable for a wide range of applications. It is also designed to be highly scalable, allowing for future upgrades and enhancements. This means that it can be used in advanced communication systems, such as 5G networks or the Internet of Things (IoT).
The chip model 5SGSMD3H2F35I2N is designed to be highly reliable and cost-effective. It is designed to be compatible with a wide range of technologies, including digital signal processing, analog signal processing, and radio frequency (RF) technology. This means that it can be used in a variety of applications, including wireless networks, automotive systems, and industrial applications.
The chip model 5SGSMD3H2F35I2N is designed to meet the needs of future technology. It is designed with the latest technologies in mind, such as 5G, IoT, and artificial intelligence (AI). This means that it can be used in a variety of applications, including advanced communication systems, autonomous vehicles, and smart homes.
The chip model 5SGSMD3H2F35I2N is designed to be highly reliable and cost-effective. It is designed to be compatible with a wide range of technologies, including digital signal processing, analog signal processing, and radio frequency (RF) technology. This means that it can be used in a variety of applications, including wireless networks, automotive systems, and industrial applications.
The chip model 5SGSMD3H2F35I2N is designed to be highly efficient and reliable. It is designed to meet the needs of future technology, meaning that it can be used in a variety of applications, including advanced communication systems, autonomous vehicles, and smart homes. It is also designed to be highly scalable, allowing for future upgrades and enhancements. This means that it can be used in advanced communication systems, such as 5G networks or the Internet of Things (IoT).
Overall, the chip model 5SGSMD3H2F35I2N is designed to be highly reliable and cost-effective. It is designed to meet the needs of future technology, and is highly scalable, allowing for future upgrades and enhancements. It is also designed to be compatible with a wide range of technologies, including digital signal processing, analog signal processing, and radio frequency (RF) technology. This means that it can be used in a variety of applications, including wireless networks, automotive systems, and industrial applications. As the demand for this chip model increases, so too will the need for new technologies to support its application environment.
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2,225 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||