5SGSMD3H2F35C3N
5SGSMD3H2F35C3N
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Intel Corporation

5SGSMD3H2F35C3N


5SGSMD3H2F35C3N
F18-5SGSMD3H2F35C3N
Active
IC FPGA 432 I/O 1152FBGA
1152-FBGA (35x35)

5SGSMD3H2F35C3N ECAD Model


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5SGSMD3H2F35C3N Attributes


Type Description Select
Mfr Intel
Series Stratix® V GS
Package Tray
Number of LABs/CLBs 89000
Number of Logic Elements/Cells 236000
Total RAM Bits 13312000
Number of I/O 432
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number 5SGSMD3

5SGSMD3H2F35C3N Datasheet Download


5SGSMD3H2F35C3N Overview



The chip model 5SGSMD3H2F35C3N is a highly advanced integrated circuit designed to meet the needs of modern communication systems. It is an innovative solution that combines the latest technologies in order to provide a comprehensive set of features and capabilities. The design of this chip was created with the intention of providing a powerful platform for advanced communication systems, as well as providing a reliable and secure solution for the future.


The 5SGSMD3H2F35C3N chip is designed to be highly compatible with the latest technologies, such as 5G, Wi-Fi 6, and AI-based networks. This makes it a great choice for applications in the era of fully intelligent systems. It is also capable of supporting a wide range of applications, including data transmission, voice over IP, and video streaming. The chip also has the potential to be used in advanced scenarios, such as virtual reality, augmented reality, and autonomous vehicle networks.


In terms of product design and requirements, the 5SGSMD3H2F35C3N chip is designed to meet the needs of modern communication systems. It is designed to be highly reliable and secure, with features such as hardware-based encryption, secure boot, and secure storage. It is also designed to provide low-power consumption and low-latency performance, making it suitable for use in a variety of scenarios.


In order to ensure the success of the 5SGSMD3H2F35C3N chip, there are a number of case studies and precautions that need to be taken into consideration. These include making sure that the chip is properly tested and validated, as well as ensuring that the chip is compatible with the latest technologies. Additionally, it is important to ensure that the chip is optimized for the specific application it is intended for, as well as making sure that the chip is regularly updated in order to keep up with the latest technologies.


Overall, the 5SGSMD3H2F35C3N chip is a highly advanced integrated circuit designed to meet the needs of modern communication systems. It is an innovative solution that combines the latest technologies in order to provide a comprehensive set of features and capabilities. With its potential for use in advanced scenarios, as well as its reliability and security features, the 5SGSMD3H2F35C3N chip is an ideal choice for applications in the era of fully intelligent systems. However, it is important to ensure that the chip is properly tested and validated, as well as optimized for the specific application it is intended for, in order to ensure its success.



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