5SGSMD3H1F35C2L
5SGSMD3H1F35C2L
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Intel Corporation

5SGSMD3H1F35C2L


5SGSMD3H1F35C2L
F18-5SGSMD3H1F35C2L
Active
IC FPGA 432 I/O 1152FBGA
1152-FBGA (35x35)

5SGSMD3H1F35C2L ECAD Model


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5SGSMD3H1F35C2L Attributes


Type Description Select
Mfr Intel
Series Stratix® V GS
Package Tray
Number of LABs/CLBs 89000
Number of Logic Elements/Cells 236000
Total RAM Bits 13312000
Number of I/O 432
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number 5SGSMD3

5SGSMD3H1F35C2L Datasheet Download


5SGSMD3H1F35C2L Overview



The chip model 5SGSMD3H1F35C2L is a semiconductor device that is designed to support a wide range of applications in the electronics industry. It is a highly advanced device that is capable of supporting the latest technologies and providing the highest levels of performance. It is an ideal solution for a wide range of applications, including high-speed networking, high-end computing, and other demanding applications.


The chip model 5SGSMD3H1F35C2L is designed for use in a variety of different environments, including industrial, automotive, and consumer electronics. It is designed to be compatible with a wide range of operating systems and can be used in a variety of different applications. Its features include high-speed data transfer, low power consumption, and high-density memory. It is also designed to be highly reliable and durable, making it an ideal choice for a wide range of applications.


When it comes to industry trends, the chip model 5SGSMD3H1F35C2L is expected to be used in a variety of different applications in the future. It is likely to be used in high-speed networking applications, such as 5G networks, as well as in intelligent applications such as autonomous vehicles and robotics. It is also likely to be used in the era of fully intelligent systems, where it can be used to power a variety of different devices and services.


The product description and specific design requirements of the chip model 5SGSMD3H1F35C2L are designed to meet the needs of a wide range of applications. It is designed to be highly reliable and durable, and is designed to provide the highest levels of performance. It is also designed to be compatible with a wide range of operating systems and can be used in a variety of different applications. It is also designed to be highly efficient and cost-effective, making it an ideal choice for a variety of applications.


When it comes to actual case studies and precautions, the chip model 5SGSMD3H1F35C2L is designed to be highly reliable and durable. It is designed to provide the highest levels of performance and is designed to be compatible with a wide range of operating systems and can be used in a variety of different applications. It is also designed to be highly efficient and cost-effective, making it an ideal choice for a variety of applications. Additionally, it is important to note that the chip model 5SGSMD3H1F35C2L is designed to be used in a variety of different environments, including industrial, automotive, and consumer electronics. Therefore, it is important to ensure that the chip model 5SGSMD3H1F35C2L is used in the correct environment to ensure optimal performance and reliability.



1,825 In Stock


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Unit Price: $4,558.112
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,239.0442 $4,239.0442
10+ $4,193.4630 $41,934.6304
100+ $3,965.5574 $396,555.7440
1000+ $3,737.6518 $1,868,825.9200
10000+ $3,418.5840 $3,418,584.0000
The price is for reference only, please refer to the actual quotation!

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