
Intel Corporation
5SGSMD3E3H29I3G
5SGSMD3E3H29I3G ECAD Model
5SGSMD3E3H29I3G Attributes
Type | Description | Select |
---|---|---|
Part Life Cycle Code | Active | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Ihs Manufacturer | INTEL CORP | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991 |
5SGSMD3E3H29I3G Datasheet Download
5SGSMD3E3H29I3G Overview
The chip model 5SGSMD3E3H29I3G is a powerful and innovative semiconductor device designed to meet the ever-growing demands of modern communication systems. It is a multi-functional device that integrates advanced analog, digital, and mixed-signal capabilities. With its advanced design and features, it offers a wide range of benefits to users in the industry.
The 5SGSMD3E3H29I3G is designed to be a low-power, high-performance chip with a wide range of features. It is capable of handling multiple communication protocols, including Ethernet, Wi-Fi, Bluetooth, and more. It also features a wide range of features such as high-speed data transfer, low-latency data processing, and high-precision timing. This makes it an ideal solution for applications such as industrial automation, medical devices, and more.
The chip model 5SGSMD3E3H29I3G is expected to experience increased demand in the near future, due to its advanced features and capabilities. It is capable of providing improved performance for a variety of applications, while still providing a cost-effective solution. In addition, its low-power design makes it an ideal choice for applications that require energy efficiency.
The original design intention of the chip model 5SGSMD3E3H29I3G was to create a powerful and innovative device that could meet the needs of the modern communication systems. It was designed with a wide range of features and capabilities, making it a perfect solution for a variety of applications. In addition, its low-power design makes it an ideal choice for applications that require energy efficiency.
The 5SGSMD3E3H29I3G also has the potential for future upgrades, allowing it to be used in more advanced communication systems. This could include features such as high-speed data transfer, low-latency data processing, and high-precision timing. With its advanced features and capabilities, it can be used for a variety of applications, including industrial automation, medical devices, and more.
The product description of the chip model 5SGSMD3E3H29I3G includes a wide range of features and capabilities. It features a low-power design, making it an ideal choice for applications that require energy efficiency. It also features a wide range of features such as high-speed data transfer, low-latency data processing, and high-precision timing. In addition, it is capable of handling multiple communication protocols, including Ethernet, Wi-Fi, Bluetooth, and more.
Actual case studies have shown that the chip model 5SGSMD3E3H29I3G has been used in a variety of applications, including industrial automation, medical devices, and more. It has been able to provide improved performance for these applications, while still providing a cost-effective solution. In addition, its low-power design has made it an ideal choice for applications that require energy efficiency.
When using the chip model 5SGSMD3E3H29I3G, it is important to take into consideration the specific design requirements of the device. This includes the operating environment, power requirements, and the specific features and capabilities of the device. It is also important to ensure that the device is properly installed and configured, and that any necessary maintenance is performed on a regular basis.
The chip model 5SGSMD3E3H29I3G is a powerful and innovative semiconductor device designed to meet the ever-growing demands of modern communication systems. With its advanced features and capabilities, it offers a wide range of benefits to users in the industry. It is expected to experience increased demand in the near future, due to its advanced features and capabilities. In addition, its low-power design makes it an ideal choice for applications that require energy efficiency. It also has the potential for future upgrades, allowing it to be used in more advanced communication systems. When using the chip model 5SGSMD3E3H29I3G, it is important to take into consideration the specific design requirements of the device, as well as any necessary maintenance that must be performed on a regular basis.
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4,756 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $10,551.5200 | $10,551.5200 |
10+ | $10,438.0628 | $104,380.6277 |
100+ | $9,870.7767 | $987,077.6748 |
1000+ | $9,303.4907 | $4,651,745.3640 |
10000+ | $8,509.2903 | $8,509,290.3000 |
The price is for reference only, please refer to the actual quotation! |