5SGSMD3E3H29C3N
5SGSMD3E3H29C3N
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Intel Corporation

5SGSMD3E3H29C3N


5SGSMD3E3H29C3N
F18-5SGSMD3E3H29C3N
Active
IC FPGA 360 I/O 780HBGA
780-HBGA (33x33)

5SGSMD3E3H29C3N ECAD Model


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5SGSMD3E3H29C3N Attributes


Type Description Select
Mfr Intel
Series Stratix® V GS
Package Tray
Number of LABs/CLBs 89000
Number of Logic Elements/Cells 236000
Total RAM Bits 13312000
Number of I/O 360
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-HBGA (33x33)
Base Product Number 5SGSMD3

5SGSMD3E3H29C3N Datasheet Download


5SGSMD3E3H29C3N Overview



The chip model 5SGSMD3E3H29C3N is a high-performance, low-power, and low-cost device designed for advanced communication systems. It is a System-on-Chip (SoC) that combines a number of components, including microprocessors, digital signal processors, and memory, into a single integrated circuit. The device was designed to reduce the complexity and cost of building complex communication systems.


The original design intention of the 5SGSMD3E3H29C3N was to provide a reliable, low-power, and low-cost solution for advanced communication systems. It has the potential to be used in a variety of applications, including wireless communications, satellite communications, and fiber optics. It is also capable of supporting the development of intelligent robots and other advanced technologies.


The 5SGSMD3E3H29C3N is a versatile device that can be applied to a variety of networks and intelligent scenarios. It is capable of supporting 5G networks and other advanced communication systems. It is also capable of being used in the era of fully intelligent systems, allowing for the development and popularization of advanced technologies such as robotics and artificial intelligence.


In order to effectively use the 5SGSMD3E3H29C3N, a variety of technical talents are required. These include software developers, hardware engineers, and system architects. Additionally, the device requires a deep understanding of the underlying communication protocols and architectures. With the proper technical knowledge and expertise, the 5SGSMD3E3H29C3N can be used to create powerful, reliable, and cost-effective communication systems.


In conclusion, the chip model 5SGSMD3E3H29C3N was designed with the intention of providing a reliable and cost-effective solution for advanced communication systems. It has the potential to be used in a variety of networks and intelligent scenarios, including 5G networks and the development of intelligent robots. In order to effectively use the device, a variety of technical talents are required, including software developers, hardware engineers, and system architects. With the proper technical knowledge and expertise, the 5SGSMD3E3H29C3N can be used to create powerful and reliable communication systems.



1,540 In Stock


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Unit Price: $1,804.0056
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,677.7252 $1,677.7252
10+ $1,659.6852 $16,596.8515
100+ $1,569.4849 $156,948.4872
1000+ $1,479.2846 $739,642.2960
10000+ $1,353.0042 $1,353,004.2000
The price is for reference only, please refer to the actual quotation!

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