5SGSMD3E2H29C2LN
5SGSMD3E2H29C2LN
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Intel Corporation

5SGSMD3E2H29C2LN


5SGSMD3E2H29C2LN
F18-5SGSMD3E2H29C2LN
Active
IC FPGA 360 I/O 780HBGA
780-HBGA (33x33)

5SGSMD3E2H29C2LN ECAD Model


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5SGSMD3E2H29C2LN Attributes


Type Description Select
Mfr Intel
Series Stratix® V GS
Package Tray
Number of LABs/CLBs 89000
Number of Logic Elements/Cells 236000
Total RAM Bits 13312000
Number of I/O 360
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-HBGA (33x33)
Base Product Number 5SGSMD3

5SGSMD3E2H29C2LN Datasheet Download


5SGSMD3E2H29C2LN Overview



The chip model 5SGSMD3E2H29C2LN is a highly advanced semiconductor device that has been designed to facilitate the development of cutting-edge technology. This chip model is a powerful and versatile component that has been designed to meet the needs of a variety of applications, from consumer electronics to industrial applications.


The chip model 5SGSMD3E2H29C2LN has many advantages over other chip models. It is designed to be power efficient, which means it can be used in a wide range of applications, from low-power consumer electronics to high-power industrial applications. It also has a wide range of features and capabilities, including high-speed signal processing, low-power operation, and a wide range of communication protocols.


The chip model 5SGSMD3E2H29C2LN is expected to be in high demand in the future, especially in the areas of consumer electronics, industrial automation, and automotive applications. This is due to its power efficiency, wide range of features, and its ability to be used in a variety of applications. The chip model is also expected to be used in the development of new technologies, such as 5G networks and artificial intelligence, as these technologies become more prevalent in the future.


The chip model 5SGSMD3E2H29C2LN can be used in a variety of networks, including wireless networks, cellular networks, and wired networks. It can also be used in intelligent scenarios, such as autonomous vehicles, smart homes, and smart cities. This chip model is expected to be a key component in the development of fully intelligent systems, as it is capable of processing data quickly and efficiently.


In conclusion, the chip model 5SGSMD3E2H29C2LN is a powerful and versatile component that is expected to be in high demand in the future. It is designed to be power efficient and has a wide range of features and capabilities. It can be used in a variety of networks and intelligent scenarios, and is expected to be a key component in the development of fully intelligent systems.



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