5SGSMD3E2H29C2L
5SGSMD3E2H29C2L
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Intel Corporation

5SGSMD3E2H29C2L


5SGSMD3E2H29C2L
F18-5SGSMD3E2H29C2L
Active
IC FPGA 360 I/O 780HBGA
780-HBGA (33x33)

5SGSMD3E2H29C2L ECAD Model


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5SGSMD3E2H29C2L Attributes


Type Description Select
Mfr Intel
Series Stratix® V GS
Package Tray
Number of LABs/CLBs 89000
Number of Logic Elements/Cells 236000
Total RAM Bits 13312000
Number of I/O 360
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-HBGA (33x33)
Base Product Number 5SGSMD3

5SGSMD3E2H29C2L Datasheet Download


5SGSMD3E2H29C2L Overview



The chip model 5SGSMD3E2H29C2L is a highly advanced integrated circuit designed and manufactured by Altera Corporation. It is a multi-function device designed to provide enhanced performance and reliability for a wide range of applications. The chip model is designed to be a low-cost solution for a variety of projects, and its features make it an ideal choice for a range of industries.


The chip model 5SGSMD3E2H29C2L offers a number of advantages, including high-speed operation, low-power consumption, and high-density memory. It is also designed with a wide range of integrated peripherals, making it suitable for a wide range of applications. The chip model is also designed with advanced communication systems in mind, and is capable of providing high-speed data transfer and reliable communication between connected devices.


The chip model 5SGSMD3E2H29C2L is expected to experience an increase in demand in the near future, particularly in the areas of communication and networking. As the need for faster and more reliable communication and networking increases, the chip model is likely to become a popular choice for a variety of industries. In addition, the chip model is also likely to be upgraded in the near future, allowing for greater performance and reliability.


The product description of the chip model 5SGSMD3E2H29C2L is designed to meet the needs of a wide range of applications. The chip model is designed with a number of features, including a high-speed processor, high-density memory, and a wide range of integrated peripherals. The chip model is also designed with advanced communication systems in mind, and is capable of providing high-speed data transfer and reliable communication between connected devices.


In addition to the product description, there are a number of case studies and precautions that should be taken when using the chip model 5SGSMD3E2H29C2L. These include ensuring that the chip model is properly installed and configured, and that it is used in accordance with the manufacturer’s instructions. In addition, it is important to ensure that the chip model is not subjected to excessive temperature or humidity, as this could damage the chip model.


Overall, the chip model 5SGSMD3E2H29C2L is a highly advanced integrated circuit designed and manufactured by Altera Corporation. It is a multi-function device designed to provide enhanced performance and reliability for a wide range of applications. The chip model offers a number of advantages, including high-speed operation, low-power consumption, and high-density memory. In addition, the chip model is expected to experience an increase in demand in the near future, particularly in the areas of communication and networking. Furthermore, the product description and case studies provide important information on how to properly use and configure the chip model.



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