
Intel Corporation
5SGSMD3E1H29C2LN
5SGSMD3E1H29C2LN ECAD Model
5SGSMD3E1H29C2LN Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® V GS | |
Package | Tray | |
Number of LABs/CLBs | 89000 | |
Number of Logic Elements/Cells | 236000 | |
Total RAM Bits | 13312000 | |
Number of I/O | 360 | |
Voltage - Supply | 0.82V ~ 0.88V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 780-BBGA, FCBGA | |
Supplier Device Package | 780-HBGA (33x33) | |
Base Product Number | 5SGSMD3 |
5SGSMD3E1H29C2LN Datasheet Download
5SGSMD3E1H29C2LN Overview
The chip model 5SGSMD3E1H29C2LN is an advanced integrated circuit designed to meet the demands of modern communication systems. It is a state-of-the-art product that combines the latest technologies to provide a comprehensive solution for modern communication systems.
The 5SGSMD3E1H29C2LN chip model was designed with the intention of providing a comprehensive solution for the needs of modern communication systems. It is based on the latest technologies, such as advanced signal processing, digital signal processing, and high-speed data transmission. The chip model is also capable of providing high-speed data transmission, low power consumption, and high reliability.
The 5SGSMD3E1H29C2LN chip model has several advantages over its competitors. First, it is designed to be highly efficient and reliable. It is also designed to be able to handle high-speed data transmission, low power consumption, and high reliability. Furthermore, it is designed to be able to handle a wide range of communication systems, including wireless and wired systems.
The 5SGSMD3E1H29C2LN chip model is also designed to be highly upgradable. It is designed to be able to handle the latest technologies, such as 5G and 6G, as well as the latest communication protocols. It is also designed to be able to handle the latest communication systems, such as LTE, Wi-Fi, and Bluetooth. Furthermore, it is designed to be able to handle the latest data transmission technologies, such as Wi-Fi 6 and Bluetooth 5.
The 5SGSMD3E1H29C2LN chip model is designed to meet the specific design requirements of modern communication systems. It is designed to be able to handle a wide range of communication protocols and technologies. It is also designed to be able to handle a wide range of data transmission technologies, such as Wi-Fi 6 and Bluetooth 5. Furthermore, it is designed to be able to handle a wide range of communication systems, such as LTE, Wi-Fi, and Bluetooth.
The 5SGSMD3E1H29C2LN chip model is expected to be in high demand in the future. This is due to its advanced features, as well as its ability to handle the latest technologies and protocols. Furthermore, it is expected to be used in a wide range of communication systems, such as wireless and wired systems.
The 5SGSMD3E1H29C2LN chip model is designed to meet the specific design requirements of modern communication systems. As such, it should be used in accordance with the specific requirements of the system. Furthermore, it should be used in accordance with the specific requirements of the communication system. It should also be used in accordance with the specific requirements of the data transmission technology.
In conclusion, the 5SGSMD3E1H29C2LN chip model is an advanced integrated circuit designed to meet the demands of modern communication systems. It is designed to be highly efficient and reliable, as well as to handle a wide range of communication protocols and technologies. It is also designed to be highly upgradable, and is expected to be in high demand in the future. Furthermore, it should be used in accordance with the specific requirements of the communication system and the data transmission technology.
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3,985 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,415.7860 | $2,415.7860 |
10+ | $2,389.8098 | $23,898.0981 |
100+ | $2,259.9288 | $225,992.8843 |
1000+ | $2,130.0479 | $1,065,023.9376 |
10000+ | $1,948.2145 | $1,948,214.5200 |
The price is for reference only, please refer to the actual quotation! |