Intel Corporation
5SGSMD3E1H29C2LG
5SGSMD3E1H29C2LG ECAD Model
5SGSMD3E1H29C2LG Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Ihs Manufacturer | INTEL CORP | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991 |
5SGSMD3E1H29C2LG Datasheet Download
5SGSMD3E1H29C2LG Overview
The chip model 5SGSMD3E1H29C2LG is a breakthrough in the semiconductor industry, and its potential applications are vast. This chip model is designed to improve the performance of devices and networks, and it is expected to be widely used in the future.
The chip model 5SGSMD3E1H29C2LG is designed to provide a high-speed, low-power solution for networks and other applications. It is designed to be used in a variety of scenarios, including wireless networks, home automation, and industrial automation. It is also designed to be used in the era of fully intelligent systems.
The chip model 5SGSMD3E1H29C2LG is designed to be compatible with a variety of technologies, including Bluetooth, Wi-Fi, and Zigbee. It is also designed to be compatible with a wide range of operating systems, including Android, iOS, and Windows. It is also designed to be compatible with a variety of protocols, including TCP/IP, UDP/IP, and IPv6.
The chip model 5SGSMD3E1H29C2LG is designed to be highly reliable and secure. It is designed to be resistant to tampering and hacking, and it is also designed to be resistant to electrical and environmental interference. It is also designed to be resistant to power surges, temperature changes, and other environmental factors.
The chip model 5SGSMD3E1H29C2LG is designed to be cost-effective, and it is expected to be widely used in the future. It is designed to be easy to install and maintain, and it is designed to be compatible with a variety of devices and systems.
The chip model 5SGSMD3E1H29C2LG is designed to be highly reliable and secure, and it is expected to be widely used in the future. It is designed to provide a high-speed, low-power solution for networks and other applications. It is also designed to be compatible with a variety of technologies, including Bluetooth, Wi-Fi, and Zigbee, and it is designed to be compatible with a wide range of operating systems, including Android, iOS, and Windows. It is also designed to be resistant to tampering and hacking, and it is designed to be resistant to electrical and environmental interference.
The chip model 5SGSMD3E1H29C2LG is expected to be widely adopted in the future, and it is expected to be used in a variety of intelligent scenarios. It is expected to be used in home automation, industrial automation, and wireless networks. It is also expected to be used in the era of fully intelligent systems.
The chip model 5SGSMD3E1H29C2LG is designed to be cost-effective and reliable, and it is expected to be widely used in the future. It is important to understand the product description and specific design requirements of the chip model 5SGSMD3E1H29C2LG, as well as the actual case studies and precautions. Understanding these aspects of the chip model 5SGSMD3E1H29C2LG will help ensure its successful application and use in the future.
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4,319 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,826.5706 | $3,826.5706 |
| 10+ | $3,785.4246 | $37,854.2464 |
| 100+ | $3,579.6950 | $357,969.5040 |
| 1000+ | $3,373.9654 | $1,686,982.7200 |
| 10000+ | $3,085.9440 | $3,085,944.0000 |
| The price is for reference only, please refer to the actual quotation! | ||