5SGSMD3E1H29C2L
5SGSMD3E1H29C2L
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Intel Corporation

5SGSMD3E1H29C2L


5SGSMD3E1H29C2L
F18-5SGSMD3E1H29C2L
Active
IC FPGA 360 I/O 780HBGA
780-HBGA (33x33)

5SGSMD3E1H29C2L ECAD Model


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5SGSMD3E1H29C2L Attributes


Type Description Select
Mfr Intel
Series Stratix® V GS
Package Tray
Number of LABs/CLBs 89000
Number of Logic Elements/Cells 236000
Total RAM Bits 13312000
Number of I/O 360
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-HBGA (33x33)
Base Product Number 5SGSMD3

5SGSMD3E1H29C2L Datasheet Download


5SGSMD3E1H29C2L Overview



The chip model 5SGSMD3E1H29C2L is a new generation of advanced technology developed by Altera Corporation, a leading semiconductor company. It is a field programmable gate array (FPGA) designed for a variety of applications, including high-speed data processing, communications, and embedded systems. The 5SGSMD3E1H29C2L is designed to provide high performance, low power consumption, and high scalability. It has a wide range of features such as high-speed transceivers, multi-gigabit transceivers, and embedded memory blocks.


The 5SGSMD3E1H29C2L is designed to meet the needs of the communications industry, specifically for use in high-speed networking and communications systems. It provides a high-speed, low-power solution for communication systems, allowing for faster data transfer and higher data rates. It also offers a range of features such as high-speed transceivers, multi-gigabit transceivers, and embedded memory blocks, making it an ideal solution for high-speed communication systems.


The 5SGSMD3E1H29C2L is designed with the intention of providing a high-performance and low-power solution for communication systems. It is designed to be highly scalable, allowing for upgrades and improvements over time. It is also designed to be backward compatible with existing communication systems, allowing for easy integration with existing systems. Additionally, it is designed to be compatible with advanced communication systems, allowing for the use of new technologies and applications.


The 5SGSMD3E1H29C2L is expected to be in high demand in the future as the communications industry continues to evolve and new technologies become available. It is well suited for use in high-speed networking and communications systems, and its scalability and compatibility with existing systems make it an ideal solution for future applications. Additionally, its ability to be upgraded and improved over time makes it a good choice for future applications.


In conclusion, the chip model 5SGSMD3E1H29C2L is a high-performance, low-power solution for communication systems. It is designed to be highly scalable and compatible with existing systems, allowing for easy integration with existing systems. Additionally, it is designed to be compatible with advanced communication systems, allowing for the use of new technologies and applications. Its scalability and compatibility make it an ideal solution for future applications, and its ability to be upgraded and improved make it a good choice for future applications.



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