5SGSED6N3F45C3N
5SGSED6N3F45C3N
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Intel Corporation

5SGSED6N3F45C3N


5SGSED6N3F45C3N
F18-5SGSED6N3F45C3N
Active
IC FPGA 840 I/O 1932FBGA
1932-FBGA, FC (45x45)

5SGSED6N3F45C3N ECAD Model


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5SGSED6N3F45C3N Attributes


Type Description Select
Mfr Intel
Series Stratix® V GS
Package Tray
Number of LABs/CLBs 220000
Number of Logic Elements/Cells 583000
Total RAM Bits 46080000
Number of I/O 840
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1932-BBGA, FCBGA
Supplier Device Package 1932-FBGA, FC (45x45)
Base Product Number 5SGSED6

5SGSED6N3F45C3N Datasheet Download


5SGSED6N3F45C3N Overview



The chip model 5SGSED6N3F45C3N is a revolutionary new development in the chip industry. It is a powerful and efficient device that is capable of handling complex tasks and providing reliable performance. This chip model is designed to be used in a wide range of applications, from consumer electronics to industrial equipment. It is also designed to be able to support advanced communication systems and to be easily upgradable in the future.


The 5SGSED6N3F45C3N chip model offers many features and advantages over its competitors. It has an advanced architecture that allows for a wide range of performance levels and a variety of applications. It also has a robust power management system that ensures reliable operation and energy efficiency. Additionally, the chip model is designed to be easily upgradable and maintainable, making it a great choice for long-term use.


When it comes to industry trends, the 5SGSED6N3F45C3N chip model is at the forefront. It is designed to be able to support new technologies, such as 5G and LTE, as well as other emerging technologies. This chip model is also designed to be compatible with a wide range of operating systems and platforms, making it a great choice for the future.


When it comes to the product description and specific design requirements of the 5SGSED6N3F45C3N chip model, it is designed to meet the highest standards of quality and performance. It has a wide range of features and capabilities, including a powerful processor, advanced memory, and a variety of communication protocols. Additionally, the chip model is designed to be easily upgradable and maintainable, offering a great choice for long-term use.


When it comes to actual case studies and precautions, the 5SGSED6N3F45C3N chip model has been tested in a variety of applications and environments. It has been proven to be reliable and efficient in both consumer and industrial settings. Additionally, the chip model is designed to be easy to maintain and upgrade, making it a great choice for long-term use.


All in all, the 5SGSED6N3F45C3N chip model is a revolutionary new development in the chip industry. It is designed to be able to support new technologies, provide reliable performance, and be easily upgradable in the future. Additionally, it has a robust power management system and is designed to meet the highest standards of quality and performance. With its advanced architecture and wide range of features, the 5SGSED6N3F45C3N chip model is sure to be a great choice for any application.



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