5SGSED6K2F40C3N
5SGSED6K2F40C3N
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Intel Corporation

5SGSED6K2F40C3N


5SGSED6K2F40C3N
F18-5SGSED6K2F40C3N
Active
IC FPGA 696 I/O 1517FBGA
1517-FBGA (40x40)

5SGSED6K2F40C3N ECAD Model


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5SGSED6K2F40C3N Attributes


Type Description Select
Mfr Intel
Series Stratix® V GS
Package Tray
Number of LABs/CLBs 220000
Number of Logic Elements/Cells 583000
Total RAM Bits 46080000
Number of I/O 696
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FBGA (40x40)
Base Product Number 5SGSED6

5SGSED6K2F40C3N Datasheet Download


5SGSED6K2F40C3N Overview



The chip model 5SGSED6K2F40C3N is an advanced integrated circuit (IC) designed for use in communication systems. It is a single-chip solution that combines multiple functions such as radio frequency (RF) transceiver, baseband processor, and power management functions. This chip is designed to be used in a variety of applications, including wireless communication, satellite communication, and military communication.


The chip model 5SGSED6K2F40C3N is designed to meet the most advanced communication needs. It can be used in high-speed data transmission, high-performance signal processing, and low-power consumption applications. It supports multiple frequency bands, and its power management system reduces power consumption. Additionally, the chip model 5SGSED6K2F40C3N is designed to be compatible with the latest communication standards, such as the 5G standard.


The chip model 5SGSED6K2F40C3N is designed to be upgradable, so that it can be used in future communication systems. It supports the latest communication technologies, such as the 5G standard, and can be used in advanced communication systems. Additionally, the chip model 5SGSED6K2F40C3N can be used in a variety of applications, including wireless communication, satellite communication, and military communication.


The chip model 5SGSED6K2F40C3N has specific design requirements that must be met in order for it to function properly. It must be designed to be compatible with the latest communication standards, such as the 5G standard. Additionally, the chip model 5SGSED6K2F40C3N must support multiple frequency bands and have a power management system that reduces power consumption. The chip must also be designed to be upgradable, so that it can be used in future communication systems.


In order to ensure that the chip model 5SGSED6K2F40C3N meets the required design specifications, it is important to consider actual case studies and precautions. For example, the chip must be tested in a variety of environments to ensure that it meets the required performance standards. Additionally, the chip must be tested in a variety of communication systems to ensure that it is compatible with the latest communication standards.


In conclusion, the chip model 5SGSED6K2F40C3N is an advanced integrated circuit designed for use in communication systems. It is designed to meet the most advanced communication needs, and can be used in a variety of applications. Additionally, the chip model 5SGSED6K2F40C3N is designed to be upgradable, so that it can be used in future communication systems. In order to ensure that the chip meets the required design specifications, it is important to consider actual case studies and precautions.



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