5SEEBF45C4N
5SEEBF45C4N
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Intel Corporation

5SEEBF45C4N


5SEEBF45C4N
F18-5SEEBF45C4N
Active
IC FPGA 840 I/O 1932FBGA
1932-FBGA, FC (45x45)

5SEEBF45C4N ECAD Model


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5SEEBF45C4N Attributes


Type Description Select
Mfr Intel
Series Stratix® V E
Package Tray
Number of LABs/CLBs 359250
Number of Logic Elements/Cells 952000
Total RAM Bits 53248000
Number of I/O 840
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1932-BBGA, FCBGA
Supplier Device Package 1932-FBGA, FC (45x45)
Base Product Number 5SEEBF45

5SEEBF45C4N Datasheet Download


5SEEBF45C4N Overview



The chip model 5SEEBF45C4N is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, allowing for more efficient and accurate coding of complex tasks. The chip model 5SEEBF45C4N provides a great deal of flexibility for the user, making it ideal for a variety of applications.


The original design intention of the chip model 5SEEBF45C4N was to provide an efficient and powerful solution for digital signal processing and embedded processing. It is designed to be able to handle complex tasks quickly and accurately, while being able to be upgraded in the future. This makes it ideal for a variety of applications, such as advanced communication systems.


The 5SEEBF45C4N can be used in networks, enabling the user to create intelligent scenarios. It can be used in the era of fully intelligent systems, allowing the user to create complex systems that can be used to automate tasks and processes. The chip model 5SEEBF45C4N is also capable of being upgraded in the future, allowing for more efficient and powerful applications.


In conclusion, the chip model 5SEEBF45C4N is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, allowing for more efficient and accurate coding of complex tasks. The chip model 5SEEBF45C4N can be used in networks and intelligent scenarios, and can be upgraded in the future for more efficient and powerful applications. This makes it ideal for a variety of applications, including advanced communication systems.



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