5CSEBA6U23I7N
5CSEBA6U23I7N
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rohs

Intel Corporation

5CSEBA6U23I7N


5CSEBA6U23I7N
F18-5CSEBA6U23I7N
Active
IC SOC CORTEX-A9 800MHZ 672UBGA
672-UBGA (23x23)

5CSEBA6U23I7N ECAD Model


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5CSEBA6U23I7N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.1 V
Number of Inputs 145
Number of Outputs 145
Number of Logic Cells 110000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Power Supplies 1.1,1.2/3.3,2.5 V
Supply Voltage-Max 1.13 V
Supply Voltage-Min 1.07 V
JESD-30 Code S-PBGA-B672
Qualification Status Not Qualified
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA672,28X28,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Surface Mount YES
Terminal Form BALL
Terminal Pitch 800 µm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 1.85 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description FBGA, BGA672,28X28,32
Pin Count 672
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Samacsys Manufacturer Intel

5CSEBA6U23I7N Overview



The chip model 5CSEBA6U23I7N is a high-performance field-programmable gate array (FPGA) that was designed to meet the advanced communication needs of today’s modern technology. This chip is capable of handling complex tasks, such as data processing and transmission, and can be programmed to meet the needs of different applications.


The original design intention of the chip model 5CSEBA6U23I7N was to provide a powerful and reliable solution for advanced communication needs. It is equipped with a high-speed transceiver, and its on-chip memory provides a large storage capacity. It also has a low-power design that allows it to operate efficiently with minimal power consumption.


The chip model 5CSEBA6U23I7N can be upgraded to meet the needs of future applications. It has the potential to be used in advanced communication systems, such as 5G networks, and can be programmed to handle tasks such as data transmission and processing. It can also be used in the era of fully intelligent systems, such as the Internet of Things (IoT). In addition, it can be used in intelligent scenarios, such as machine learning and artificial intelligence.


The product description of the chip model 5CSEBA6U23I7N includes its features, specifications, and design requirements. It is designed to provide a reliable and high-performance solution for advanced communication needs. It is equipped with a high-speed transceiver and a large on-chip memory, and its low-power design allows it to operate efficiently.


The design requirements of the chip model 5CSEBA6U23I7N include the ability to process complex tasks, such as data transmission and processing, and to be programmed to meet the needs of different applications. In addition, it must be able to handle tasks such as machine learning and artificial intelligence.


The chip model 5CSEBA6U23I7N has been used in several case studies, and its performance has been found to be satisfactory. It has been used in 5G networks, as well as in the Internet of Things (IoT). In addition, it has been used in machine learning and artificial intelligence applications.


When using the chip model 5CSEBA6U23I7N, there are certain precautions that must be taken. It is important to make sure that the chip is programmed correctly, and that the design requirements are met. It is also important to ensure that the chip is used in a suitable environment and that it is not exposed to extreme temperatures or other environmental conditions.


In conclusion, the chip model 5CSEBA6U23I7N is a high-performance field-programmable gate array (FPGA) that was designed to meet the advanced communication needs of today’s modern technology. It has the potential to be used in advanced communication systems, such as 5G networks, and can be programmed to handle tasks such as data transmission and processing. In addition, it can be used in the era of fully intelligent systems, such as the Internet of Things (IoT). It is important to ensure that the design requirements are met and that the chip is used in a suitable environment.



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Unit Price: $1,620.6433
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,507.1983 $1,507.1983
10+ $1,490.9918 $14,909.9184
100+ $1,409.9597 $140,995.9671
1000+ $1,328.9275 $664,463.7530
10000+ $1,215.4825 $1,215,482.4750
The price is for reference only, please refer to the actual quotation!

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