Intel Corporation
5CGXFC3B6F23I7
5CGXFC3B6F23I7 ECAD Model
5CGXFC3B6F23I7 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.1 V | |
| Number of Inputs | 224 | |
| Number of Outputs | 224 | |
| Number of Logic Cells | 31000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 1.1,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
5CGXFC3B6F23I7 Datasheet Download
5CGXFC3B6F23I7 Overview
The chip model 5CGXFC3B6F23I7 is a cutting-edge product in the semiconductor industry. It was designed to provide high-performance computing and communication capabilities for a wide range of applications. This chip model is based on the advanced 5-nanometer process technology, and it offers an impressive level of performance and functionality.
The 5CGXFC3B6F23I7 chip model has several advantages that make it an attractive choice for many applications. It is built with a high-speed processing core, which allows for a faster and more efficient operation. It also has a low power consumption rate, which helps to reduce the cost of operation. Additionally, it has a large memory capacity and a wide range of communication protocols, making it suitable for a variety of applications.
The 5CGXFC3B6F23I7 chip model is expected to have a high demand in the future. It is a versatile product that can be used in a variety of industries, including automotive, medical, and industrial. Its advanced features and capabilities make it a perfect choice for applications that require high-performance computing and communication. Additionally, its low power consumption makes it an ideal choice for applications that require a low-cost operation.
The original design intention of the chip model 5CGXFC3B6F23I7 is to provide a high-performance computing and communication solution for a wide range of applications. Its advanced features and capabilities make it a perfect choice for applications that require high-performance computing and communication. Additionally, its low power consumption makes it an ideal choice for applications that require a low-cost operation.
The chip model 5CGXFC3B6F23I7 is also capable of being upgraded in the future. Its advanced features and capabilities make it a perfect choice for applications that require high-performance computing and communication. Additionally, its low power consumption makes it an ideal choice for applications that require a low-cost operation.
The product description and specific design requirements of the chip model 5CGXFC3B6F23I7 include its advanced 5-nanometer process technology, a high-speed processing core, a large memory capacity, and a wide range of communication protocols. Additionally, it has a low power consumption rate, which helps to reduce the cost of operation. The product is also designed to be compatible with a variety of operating systems and applications.
Actual case studies and precautions need to be taken when using the 5CGXFC3B6F23I7 chip model. It is important to ensure that the chip model is properly installed and configured, as improper installation or configuration can lead to performance issues. Additionally, it is important to ensure that the chip model is compatible with the operating system and applications that are being used. It is also important to ensure that the chip model is properly cooled and maintained, as overheating can lead to performance issues.
In conclusion, the chip model 5CGXFC3B6F23I7 is a cutting-edge product in the semiconductor industry. It is designed to provide high-performance computing and communication capabilities for a wide range of applications. It has several advantages that make it an attractive choice for many applications, including its high-speed processing core, low power consumption rate, and large memory capacity. It is expected to have a high demand in the future, and its advanced features and capabilities make it a perfect choice for applications that require high-performance computing and communication. Additionally, its low power consumption makes it an ideal choice for applications that require a low-cost operation. It is important to ensure that the chip model is properly installed and configured, as improper installation or configuration can lead to performance issues. Additionally, it is important to ensure that the chip model is compatible with the operating system and applications that are being used. It is also important to ensure that the chip model is properly cooled and maintained, as overheating can lead to performance issues.
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2,201 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $173.4284 | $173.4284 |
| 10+ | $171.5635 | $1,715.6353 |
| 100+ | $162.2394 | $16,223.9427 |
| 1000+ | $152.9153 | $76,457.6610 |
| 10000+ | $139.8616 | $139,861.5750 |
| The price is for reference only, please refer to the actual quotation! | ||