5CEFA2F23C7N

The 5CEFA2F23C7N is an FPGA (Field Programmable Gate Array) chip from Xilinx. It is a member of the Kintex-7 family of FPGAs and is based on the Virtex-7 architecture. This chip contains 5,200 logic slices, each of which consists of four 6-input LUTs and 8 flip-flops. It also includes 648 DSP48E slices, each of which includes a dedicated 18x18-bit multiplier and 48-bit adder. It has a total of 4,608 Kbits of block RAM and 8,192 Kbits of distributed RAM. It also has a total of 4,608 Kbits of block RAM and 8,192 Kbits of distributed RAM.

The 5CEFA2F23C7N has an operating temperature range of -40 to 85 degrees Celsius and a maximum power dissipation of 16.5 W. It is packaged in a Flip Chip Ball Grid Array (FCBGA) package with a footprint of 28 mm x 28 mm.

The 5CEFA2F23C7N is ideal for applications such as high-performance computing, high-speed networking, and embedded systems. It has been designed to provide high-performance, low-power, and low-cost solutions for a wide range of applications. It is also suitable for use in applications such as video and image processing, digital signal processing, and high-speed communication. It can be used in a variety of applications, including automotive, aerospace, industrial, medical, and consumer electronics.