5ASXMB3G4F40C6N
5ASXMB3G4F40C6N
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rohs

Intel Corporation

5ASXMB3G4F40C6N


5ASXMB3G4F40C6N
F18-5ASXMB3G4F40C6N
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-1517
FBGA-1517

5ASXMB3G4F40C6N ECAD Model


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5ASXMB3G4F40C6N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.1 V
Number of Inputs 540
Number of Outputs 540
Number of Logic Cells 350000
Number of CLBs 13207
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL EXTENDED
Package Shape SQUARE
Organization 13207 CLBS
Supply Voltage-Max 1.13 V
Supply Voltage-Min 1.07 V
JESD-30 Code S-PBGA-B1517
JESD-609 Code e1
Operating Temperature-Max 85 °C
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 2.7 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1517
Reach Compliance Code compliant
HTS Code 8542.39.00.01

5ASXMB3G4F40C6N Datasheet Download


5ASXMB3G4F40C6N Overview



The chip model 5ASXMB3G4F40C6N is an integrated circuit designed by the semiconductor manufacturer Xilinx. It is a high-performance, low-power, low-cost FPGA solution, capable of providing users with a wide range of features and functions. The original design intention of the chip model 5ASXMB3G4F40C6N was to provide a high-performance and reliable platform for various applications, such as communication systems, intelligent robots, and other embedded systems.


The product description of the chip model 5ASXMB3G4F40C6N includes a variety of features and functions, such as a high-performance logic fabric, a wide range of I/O capabilities, and a low-power design. It also includes a variety of memory resources, such as block RAM and distributed RAM, as well as a variety of configurable logic blocks. The chip model 5ASXMB3G4F40C6N also has a wide range of power management features, allowing users to optimize power consumption for their applications.


In terms of future upgrades, the chip model 5ASXMB3G4F40C6N is capable of providing users with a wide range of features and functions. It can be used in advanced communication systems, such as 5G and 6G networks, as well as in the development and popularization of future intelligent robots. Additionally, the chip model 5ASXMB3G4F40C6N can be used in various embedded systems, such as automotive and industrial control systems.


In order to use the chip model 5ASXMB3G4F40C6N effectively, users need to have a certain level of technical knowledge and experience. This includes knowledge of digital design, FPGA architecture, and embedded systems. Additionally, users should be familiar with the various features and functions of the chip model 5ASXMB3G4F40C6N, such as the logic fabric, I/O capabilities, and power management features.


When using the chip model 5ASXMB3G4F40C6N, there are a few precautions that users should take. First, users should ensure that they are using the correct version of the chip model. Additionally, users should ensure that they are using the correct voltage and current levels when powering the chip model. Finally, users should ensure that all connections to the chip model are properly made, and that all data is correctly written to the chip model.


The chip model 5ASXMB3G4F40C6N is a high-performance, low-power, low-cost FPGA solution, capable of providing users with a wide range of features and functions. It is a suitable platform for various applications, such as communication systems, intelligent robots, and other embedded systems. It can be used in advanced communication systems, such as 5G and 6G networks, as well as in the development and popularization of future intelligent robots. In order to use the chip model 5ASXMB3G4F40C6N effectively, users need to have a certain level of technical knowledge and experience, and should take certain precautions when using the chip model.



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