
Intel Corporation
5ASXFB5G4F35C5N
5ASXFB5G4F35C5N ECAD Model
5ASXFB5G4F35C5N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.1 V | |
Number of Inputs | 540 | |
Number of Outputs | 540 | |
Number of Logic Cells | 462000 | |
Number of CLBs | 17434 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 17434 CLBS | |
Power Supplies | 1.1,1.2/3.3,2.5 V | |
Supply Voltage-Max | 1.13 V | |
Supply Voltage-Min | 1.07 V | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 2.7 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
5ASXFB5G4F35C5N Datasheet Download
5ASXFB5G4F35C5N Overview
The chip model 5ASXFB5G4F35C5N is a state-of-the-art semiconductor device that has been designed to meet the needs of a variety of industries. It is a highly advanced chip that boasts a range of impressive features, including high performance, low power consumption, and an array of integrated components. This chip model is ideal for use in a variety of applications, from networking to intelligent scenarios.
The 5ASXFB5G4F35C5N chip model has numerous advantages over traditional models. It is incredibly efficient, with high performance speeds and low power consumption. In addition, it integrates a variety of components, such as a CPU, memory, and other peripheral components, all within a single chip. This makes the chip model highly versatile and suitable for a wide range of applications. Furthermore, the chip is designed to be compatible with a variety of operating systems, allowing it to be used in a variety of environments.
The 5ASXFB5G4F35C5N chip model is expected to be in high demand in a variety of industries in the near future. It is an ideal choice for networking applications, as it can provide high-speed data transmission and low latency. In addition, it can be used in intelligent scenarios, such as machine learning and artificial intelligence. The chip model is also suitable for use in the era of fully intelligent systems, as it is designed to be compatible with a variety of operating systems and can be used to power a variety of applications.
The 5ASXFB5G4F35C5N chip model has a number of specific design requirements. It is designed to be highly efficient, with a low power consumption and high performance speeds. It also incorporates a variety of integrated components, such as a CPU, memory, and other peripheral components. Furthermore, the chip is compatible with a variety of operating systems, allowing it to be used in a variety of environments.
In addition to its design requirements, the 5ASXFB5G4F35C5N chip model has been the subject of a number of case studies. These studies have demonstrated the chip model's ability to provide high-speed data transmission and low latency, as well as its compatibility with a variety of operating systems. Furthermore, the studies have highlighted the chip model's potential for use in intelligent scenarios, such as machine learning and artificial intelligence.
When using the 5ASXFB5G4F35C5N chip model, it is important to take a number of precautions. It is important to ensure that the chip is installed correctly, as incorrect installation may lead to damage. Furthermore, it is important to ensure that the chip is compatible with the operating system and other components, as this will ensure that the chip is able to function correctly. Finally, it is important to ensure that the chip is kept clean and free of dust and debris, as this will ensure that the chip is able to perform optimally.
In conclusion, the 5ASXFB5G4F35C5N chip model is a highly advanced semiconductor device that is designed to meet the needs of a variety of industries. It boasts a range of impressive features, including high performance, low power consumption, and an array of integrated components. It is expected to be in high demand in a variety of industries in the near future, and it is suitable for use in a variety of applications, from networking to intelligent scenarios. Furthermore, it is designed to be compatible with a variety of operating systems, allowing it to be used in the era of fully intelligent systems. Finally, it is important to take a number of precautions when using the chip model, such as ensuring that it is installed correctly and is kept clean and free of dust and debris.
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2,913 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,687.0844 | $2,687.0844 |
10+ | $2,658.1911 | $26,581.9105 |
100+ | $2,513.7241 | $251,372.4147 |
1000+ | $2,369.2572 | $1,184,628.6210 |
10000+ | $2,167.0036 | $2,167,003.5750 |
The price is for reference only, please refer to the actual quotation! |