Intel Corporation
5ASXFB3H4F40I3N
5ASXFB3H4F40I3N ECAD Model
5ASXFB3H4F40I3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.15 V | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Clock Frequency-Max | 670 MHz | |
| Supply Voltage-Max | 1.18 V | |
| Supply Voltage-Min | 1.12 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1517 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
5ASXFB3H4F40I3N Datasheet Download
5ASXFB3H4F40I3N Overview
The chip model 5ASXFB3H4F40I3N has been widely used in the industry, and it has become one of the most popular chip models. This chip model is designed to provide high-performance, low-power solutions for various applications. It is designed with a wide range of features, such as advanced communication systems, high-speed data transmission, and high-performance computing.
The chip model 5ASXFB3H4F40I3N has been designed to meet the needs of a wide range of applications. It is equipped with a variety of features, such as advanced communication systems, high-speed data transmission, and high-performance computing. It also supports a number of new technologies, such as Bluetooth Low Energy, Wi-Fi, and ZigBee. These technologies are designed to improve the performance and reliability of the chip model.
In order to understand the industry trends of the chip model 5ASXFB3H4F40I3N and the future development of related industries, it is important to consider the original design intention of the chip model. The chip model was designed to meet the needs of a wide range of applications, and it is equipped with a variety of features. It is also designed to be easily upgradable, so that it can be used in advanced communication systems and other applications.
The product description and specific design requirements of the chip model 5ASXFB3H4F40I3N can be found in the product manual. The product manual provides detailed information about the features, performance, and design of the chip model. It also provides information about the actual case studies and precautions that should be taken when using the chip model.
In conclusion, the chip model 5ASXFB3H4F40I3N is designed to provide high-performance, low-power solutions for various applications. It is equipped with a variety of features, such as advanced communication systems, high-speed data transmission, and high-performance computing. It is also designed to be easily upgradable, so that it can be used in advanced communication systems and other applications. In order to understand the industry trends of the chip model 5ASXFB3H4F40I3N and the future development of related industries, it is important to consider the original design intention of the chip model. The product description and specific design requirements of the chip model 5ASXFB3H4F40I3N can be found in the product manual, along with actual case studies and precautions.
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1,572 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,374.6613 | $2,374.6613 |
| 10+ | $2,349.1273 | $23,491.2726 |
| 100+ | $2,221.4573 | $222,145.7304 |
| 1000+ | $2,093.7873 | $1,046,893.6720 |
| 10000+ | $1,915.0494 | $1,915,049.4000 |
| The price is for reference only, please refer to the actual quotation! | ||