
Intel Corporation
5ASXFB3G4F35I3N
5ASXFB3G4F35I3N ECAD Model
5ASXFB3G4F35I3N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.15 V | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Clock Frequency-Max | 670 MHz | |
Supply Voltage-Max | 1.18 V | |
Supply Voltage-Min | 1.12 V | |
JESD-30 Code | S-PBGA-B1152 | |
JESD-609 Code | e1 | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 2.7 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1152 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991 | |
HTS Code | 8542.39.00.01 |
5ASXFB3G4F35I3N Datasheet Download
5ASXFB3G4F35I3N Overview
The chip model 5ASXFB3G4F35I3N is a versatile and powerful chip, suitable for a variety of applications. It is primarily used in high-performance digital signal processing, embedded processing, and image processing, and requires the use of HDL language. This chip can be used in a variety of networks and intelligent scenarios, and is a great tool for the era of fully intelligent systems.
The product description of the chip model 5ASXFB3G4F35I3N is as follows. The chip is designed with an advanced VLSI architecture, which allows for high-speed processing of data. It has a 32-bit RISC processor core, with a maximum frequency of 3.2GHz. It also has a two-channel DDR3 SDRAM interface and a four-channel DDR4 SDRAM interface, allowing for high-bandwidth data transfer. Additionally, the chip has an integrated Ethernet controller, which allows for efficient communication between devices.
When designing with the chip model 5ASXFB3G4F35I3N, it is important to consider the specific design requirements. This includes the power budget, the clock speed, the memory size, the communication protocol, and the system architecture. It is also important to consider the thermal and electrical characteristics of the chip, as well as the cost and availability of the components.
The chip model 5ASXFB3G4F35I3N has been used in a variety of case studies. In one example, it was used in an image processing system to detect and classify objects in an image. In another example, it was used in a wireless communication system to transmit and receive data. In both cases, the chip was able to provide the necessary performance and reliability.
When designing with the chip model 5ASXFB3G4F35I3N, it is important to take certain precautions. This includes ensuring that the power budget and clock speed are set correctly, and that the memory size and communication protocol are compatible with the system architecture. Additionally, it is important to consider the thermal and electrical characteristics of the chip, as well as the cost and availability of the components.
In conclusion, the chip model 5ASXFB3G4F35I3N is a powerful and versatile chip, suitable for a variety of applications. It can be used in networks and intelligent scenarios, and is a great tool for the era of fully intelligent systems. When designing with the chip, it is important to consider the specific design requirements, as well as the thermal and electrical characteristics of the chip. With careful design and implementation, the chip model 5ASXFB3G4F35I3N can be a powerful and reliable tool for any project.
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1,868 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,187.8964 | $2,187.8964 |
10+ | $2,164.3707 | $21,643.7066 |
100+ | $2,046.7418 | $204,674.1816 |
1000+ | $1,929.1130 | $964,556.4880 |
10000+ | $1,764.4326 | $1,764,432.6000 |
The price is for reference only, please refer to the actual quotation! |