5ASXFB3G4F35I3N
5ASXFB3G4F35I3N
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rohs

Intel Corporation

5ASXFB3G4F35I3N


5ASXFB3G4F35I3N
F18-5ASXFB3G4F35I3N
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-1152
FBGA-1152

5ASXFB3G4F35I3N ECAD Model


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5ASXFB3G4F35I3N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.15 V
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Clock Frequency-Max 670 MHz
Supply Voltage-Max 1.18 V
Supply Voltage-Min 1.12 V
JESD-30 Code S-PBGA-B1152
JESD-609 Code e1
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 2.7 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1152
Reach Compliance Code compliant
ECCN Code 3A991
HTS Code 8542.39.00.01

5ASXFB3G4F35I3N Datasheet Download


5ASXFB3G4F35I3N Overview



The chip model 5ASXFB3G4F35I3N is a versatile and powerful chip, suitable for a variety of applications. It is primarily used in high-performance digital signal processing, embedded processing, and image processing, and requires the use of HDL language. This chip can be used in a variety of networks and intelligent scenarios, and is a great tool for the era of fully intelligent systems.


The product description of the chip model 5ASXFB3G4F35I3N is as follows. The chip is designed with an advanced VLSI architecture, which allows for high-speed processing of data. It has a 32-bit RISC processor core, with a maximum frequency of 3.2GHz. It also has a two-channel DDR3 SDRAM interface and a four-channel DDR4 SDRAM interface, allowing for high-bandwidth data transfer. Additionally, the chip has an integrated Ethernet controller, which allows for efficient communication between devices.


When designing with the chip model 5ASXFB3G4F35I3N, it is important to consider the specific design requirements. This includes the power budget, the clock speed, the memory size, the communication protocol, and the system architecture. It is also important to consider the thermal and electrical characteristics of the chip, as well as the cost and availability of the components.


The chip model 5ASXFB3G4F35I3N has been used in a variety of case studies. In one example, it was used in an image processing system to detect and classify objects in an image. In another example, it was used in a wireless communication system to transmit and receive data. In both cases, the chip was able to provide the necessary performance and reliability.


When designing with the chip model 5ASXFB3G4F35I3N, it is important to take certain precautions. This includes ensuring that the power budget and clock speed are set correctly, and that the memory size and communication protocol are compatible with the system architecture. Additionally, it is important to consider the thermal and electrical characteristics of the chip, as well as the cost and availability of the components.


In conclusion, the chip model 5ASXFB3G4F35I3N is a powerful and versatile chip, suitable for a variety of applications. It can be used in networks and intelligent scenarios, and is a great tool for the era of fully intelligent systems. When designing with the chip, it is important to consider the specific design requirements, as well as the thermal and electrical characteristics of the chip. With careful design and implementation, the chip model 5ASXFB3G4F35I3N can be a powerful and reliable tool for any project.



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Unit Price: $2,352.5768
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,187.8964 $2,187.8964
10+ $2,164.3707 $21,643.7066
100+ $2,046.7418 $204,674.1816
1000+ $1,929.1130 $964,556.4880
10000+ $1,764.4326 $1,764,432.6000
The price is for reference only, please refer to the actual quotation!

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