
Intel Corporation
5ASXBB3D4F31C6N
5ASXBB3D4F31C6N ECAD Model
5ASXBB3D4F31C6N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.1 V | |
Number of Inputs | 250 | |
Number of Outputs | 250 | |
Number of Logic Cells | 350000 | |
Number of CLBs | 13207 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL EXTENDED | |
Package Shape | SQUARE | |
Organization | 13207 CLBS | |
Supply Voltage-Max | 1.13 V | |
Supply Voltage-Min | 1.07 V | |
JESD-30 Code | S-PBGA-B896 | |
JESD-609 Code | e1 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 896 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA896,30X30,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 31 mm | |
Length | 31 mm | |
Seated Height-Max | 2.7 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-896 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
5ASXBB3D4F31C6N Datasheet Download
5ASXBB3D4F31C6N Overview
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The product description of the chip model 5ASXBB3D4F31C6N is designed to meet the specific requirements of the customer. It is designed to provide the best performance in a wide range of applications, while also being compatible with the latest technologies. It is also designed to be efficient and cost-effective, while still providing the best performance. Furthermore, it is designed to be reliable and durable, ensuring that it will last for many years.
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Overall, the chip model 5ASXBB3D4F31C6N is a revolutionary product that is changing the way technology is being used. It is capable of providing the best performance in a wide range of applications and is compatible with the latest technologies. It is also designed to be efficient and cost-effective, while still providing the best performance. Furthermore, it is important to consider the actual case studies and precautions to ensure that the chip is used in the right way.
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