5AGXMB3G6F35C6N
5AGXMB3G6F35C6N
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Intel Corporation

5AGXMB3G6F35C6N


5AGXMB3G6F35C6N
F18-5AGXMB3G6F35C6N
Active
IC FPGA 544 I/O 1152FBGA
1152-FBGA (35x35)

5AGXMB3G6F35C6N ECAD Model


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5AGXMB3G6F35C6N Attributes


Type Description Select
Mfr Intel
Series Arria V GX
Package Tray
Number of LABs/CLBs 17110
Number of Logic Elements/Cells 362000
Total RAM Bits 19822592
Number of I/O 544
Voltage - Supply 1.07V ~ 1.13V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1152-BBGA, FCBGA Exposed Pad
Supplier Device Package 1152-FBGA (35x35)
Base Product Number 5AGXMB3

5AGXMB3G6F35C6N Datasheet Download


5AGXMB3G6F35C6N Overview



The chip model 5AGXMB3G6F35C6N is a powerful integrated circuit that is suitable for high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be used with the HDL language for programming and can be upgraded to meet future needs.


The 5AGXMB3G6F35C6N is a field-programmable gate array (FPGA) that provides a high level of integration and performance. It is capable of providing up to 35 million logic elements and 1.2 million flip-flops. It also has an advanced memory architecture and high-speed DSP blocks.


This chip model is designed to be used in a variety of applications, including communications, medical imaging, aerospace, and industrial automation. It is also suitable for applications requiring high-speed signal processing and embedded processing. The 5AGXMB3G6F35C6N is designed to be used in advanced communication systems and can be used to create powerful and reliable solutions.


When designing with the 5AGXMB3G6F35C6N, it is important to consider the product description and design requirements. The product description outlines the features and capabilities of the chip model, while the design requirements outline the specific design specifications and the precautions that must be taken when using the chip.


When designing with the 5AGXMB3G6F35C6N, it is important to consider the design requirements and the actual case studies. Designers must understand the product description, as well as the design requirements and actual case studies, to ensure that the design meets the specific requirements. In addition, it is important to consider the precautions that must be taken when using the chip.


The 5AGXMB3G6F35C6N is a powerful integrated circuit that is suitable for high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be used with the HDL language for programming and can be upgraded to meet future needs. By understanding the product description, design requirements, and actual case studies, designers can create powerful and reliable solutions with the 5AGXMB3G6F35C6N.



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