
Intel Corporation
5AGXMB3G4F35I5G
5AGXMB3G4F35I5G ECAD Model
5AGXMB3G4F35I5G Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.1 V | |
Number of Inputs | 704 | |
Number of Outputs | 704 | |
Number of Logic Cells | 362000 | |
Number of CLBs | 13688 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 13688 CLBS | |
Supply Voltage-Max | 1.13 V | |
Supply Voltage-Min | 1.07 V | |
JESD-30 Code | S-PBGA-B1152 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 2.7 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
5AGXMB3G4F35I5G Datasheet Download
5AGXMB3G4F35I5G Overview
The chip model 5AGXMB3G4F35I5G is a new development in the semiconductor industry, offering a range of features and applications for networks, intelligent scenarios, and fully intelligent systems. This chip model is designed to meet the needs of a variety of applications, from basic consumer electronics to more complex industrial systems. It is an important part of the semiconductor industry, and its development and application will be a major factor in the future of the industry.
In order to understand the current industry trends and the potential future applications of the 5AGXMB3G4F35I5G chip model, it is important to understand its product description and design requirements. The chip model is a 5 nm process, with an ARM Cortex-A55 processor, 2GB of RAM, and 16GB of storage. It supports a variety of network protocols, including Wi-Fi, Bluetooth, and LTE. In addition, it is designed to support a range of intelligent scenarios, including voice recognition, machine learning, and natural language processing.
The 5AGXMB3G4F35I5G chip model is designed to be used in the era of fully intelligent systems. It is designed to be a powerful, efficient, and reliable solution for a variety of applications. It is designed to be used in a variety of environments, from consumer electronics to industrial applications. It is also designed to be flexible and scalable, allowing it to be used in a variety of applications and systems.
In order to understand the potential applications of the 5AGXMB3G4F35I5G chip model, it is important to consider actual case studies and precautions. For example, the chip model has been used in a variety of applications, including the development of autonomous vehicles, smart home systems, and industrial automation systems. However, it is important to consider the risks associated with the use of the chip model, such as the potential for failure or the need for additional security measures.
The 5AGXMB3G4F35I5G chip model is an important development in the semiconductor industry, and its potential applications are numerous. It is designed to be a powerful, efficient, and reliable solution for a variety of applications, and its use in the era of fully intelligent systems is a major step forward. However, it is important to consider the product description and design requirements, as well as actual case studies and precautions, in order to ensure that the chip model is used in the most effective and secure manner possible.
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2,073 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $5,826.4958 | $5,826.4958 |
10+ | $5,763.8453 | $57,638.4526 |
100+ | $5,450.5928 | $545,059.2804 |
1000+ | $5,137.3403 | $2,568,670.1720 |
10000+ | $4,698.7869 | $4,698,786.9000 |
The price is for reference only, please refer to the actual quotation! |