Intel Corporation
5AGXMB1G6F31C6G
5AGXMB1G6F31C6G ECAD Model
5AGXMB1G6F31C6G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.1 V | |
| Number of Inputs | 704 | |
| Number of Outputs | 704 | |
| Number of Logic Cells | 300000 | |
| Number of CLBs | 11321 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11321 CLBS | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-896 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
5AGXMB1G6F31C6G Datasheet Download
5AGXMB1G6F31C6G Overview
The chip model 5AGXMB1G6F31C6G is a product of the semiconductor industry, and its development has a great influence on the development of related industries. It is developed based on the latest technology and its application environment has a wide range of requirements. It is widely used in many industries such as communication, automotive, industrial control, consumer electronics, and medical applications.
The chip model 5AGXMB1G6F31C6G has many advantages, including low power consumption, high performance, and high integration. It is also equipped with advanced features such as a high-speed transceiver, a high-speed analog-to-digital converter, and a high-speed digital-to-analog converter. Its integrated memory and logic functions make it suitable for high-speed data processing and communication.
The chip model 5AGXMB1G6F31C6G is expected to have a great demand in the future, as its application environment is constantly changing. With the rapid development of communication technology, the chip model 5AGXMB1G6F31C6G is expected to have a great potential for future upgrades. It is expected to be used in advanced communication systems such as 5G, Wi-Fi 6, and Vehicle-to-Everything (V2X).
The original design intention of the chip model 5AGXMB1G6F31C6G is to provide a cost-effective solution for the communication industry. It is designed to meet the current needs of the industry and to provide the necessary performance for the future development of the industry. The chip model 5AGXMB1G6F31C6G is expected to be able to meet the requirements of the communication industry in the future, and its performance is expected to be improved to meet the needs of advanced communication systems.
In conclusion, the chip model 5AGXMB1G6F31C6G has many advantages, including low power consumption, high performance, and high integration. It is expected to have a great demand in the future, and its performance is expected to be improved to meet the needs of advanced communication systems. Its original design intention is to provide a cost-effective solution for the communication industry, and it is expected to be able to meet the requirements of the communication industry in the future.
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4,634 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,202.1536 | $3,202.1536 |
| 10+ | $3,167.7218 | $31,677.2183 |
| 100+ | $2,995.5630 | $299,556.3033 |
| 1000+ | $2,823.4042 | $1,411,702.1190 |
| 10000+ | $2,582.3819 | $2,582,381.9250 |
| The price is for reference only, please refer to the actual quotation! | ||