5AGXMA7G4F31C4G
5AGXMA7G4F31C4G
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rohs

Intel Corporation

5AGXMA7G4F31C4G


5AGXMA7G4F31C4G
F18-5AGXMA7G4F31C4G
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, FBGA-896
FBGA-896

5AGXMA7G4F31C4G ECAD Model


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5AGXMA7G4F31C4G Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.1 V
Number of Inputs 544
Number of Outputs 544
Number of Logic Cells 242000
Number of CLBs 9168
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 9168 CLBS
Supply Voltage-Max 1.13 V
Supply Voltage-Min 1.07 V
JESD-30 Code S-PBGA-B896
Operating Temperature-Max 85 °C
Number of Terminals 896
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Equivalence Code BGA896,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 31 mm
Length 31 mm
Seated Height-Max 2.7 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-896
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991

5AGXMA7G4F31C4G Datasheet Download


5AGXMA7G4F31C4G Overview



The 5AGXMA7G4F31C4G chip model is a highly advanced integrated circuit that has been developed by the semiconductor industry to address the increasing demand for high-performance computing and communication systems. This model is designed to provide a complete solution for the next generation of high-performance applications, with a focus on providing a high level of integration, power efficiency, and scalability. The chip model is designed to be used in a wide range of applications, including embedded systems, industrial automation, automotive, and telecommunications.


The 5AGXMA7G4F31C4G chip model is a highly integrated device that combines a number of different technologies into one package. It features a dual core processor, a high-speed memory controller, a high-speed serial interface, a digital signal processor, and a variety of peripherals. This integration allows for the development of highly efficient and powerful computing systems that can be used in a wide range of applications.


The 5AGXMA7G4F31C4G chip model is designed to be highly scalable, allowing for the development of systems with a wide range of performance levels. This scalability allows for the development of systems that can be used in a variety of applications, ranging from low-power embedded systems to high-performance communication systems. The chip model also features a number of advanced features, such as a power-saving mode and a low-power standby mode, which can help to reduce power consumption and extend battery life.


The 5AGXMA7G4F31C4G chip model is designed to be used in a wide range of applications, and its scalability and advanced features make it an ideal choice for a variety of advanced communication systems. The chip model is designed to be highly customizable, allowing for the development of systems that can be tailored to meet the specific needs of the application. The chip model also provides a high level of integration, making it easy to integrate the chip model into existing systems.


The 5AGXMA7G4F31C4G chip model is expected to be in high demand in the future, as it provides a high level of integration and scalability that can be used in a wide range of applications. The chip model is also designed to be highly upgradable, allowing for the development of systems that can be upgraded to meet the changing needs of the application. The chip model is also designed to be highly reliable, making it an ideal choice for the development of advanced communication systems.


In conclusion, the 5AGXMA7G4F31C4G chip model is an advanced integrated circuit that is designed to provide a complete solution for the next generation of high-performance applications. The chip model is designed to be highly scalable, allowing for the development of systems with a wide range of performance levels. The chip model is also designed to be highly upgradable, allowing for the development of systems that can be upgraded to meet the changing needs of the application. The chip model is expected to be in high demand in the future, as it provides a high level of integration and scalability that can be used in a wide range of applications.



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Unit Price: $1,150.536
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,069.9985 $1,069.9985
10+ $1,058.4931 $10,584.9312
100+ $1,000.9663 $100,096.6320
1000+ $943.4395 $471,719.7600
10000+ $862.9020 $862,902.0000
The price is for reference only, please refer to the actual quotation!

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