Intel Corporation
5AGXMA5D6F27C6G
5AGXMA5D6F27C6G ECAD Model
5AGXMA5D6F27C6G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.1 V | |
| Number of Inputs | 544 | |
| Number of Outputs | 544 | |
| Number of Logic Cells | 190000 | |
| Number of CLBs | 7170 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 7170 CLBS | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-672 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991 |
5AGXMA5D6F27C6G Datasheet Download
5AGXMA5D6F27C6G Overview
The 5AGXMA5D6F27C6G chip model is a high-performance, low-power integrated circuit designed for use in advanced communication systems. This chip model is based on the latest, most advanced technologies, and was designed to meet the highest standards of performance and reliability. Its design intention was to provide an ideal platform for the development of advanced communication systems, as well as to offer an improved user experience.
The 5AGXMA5D6F27C6G chip model is capable of being upgraded in the future, allowing it to be applied to more advanced communication systems. It is also capable of being used in the era of fully intelligent systems, as it is designed to be compatible with the latest intelligent algorithms and technologies. This chip model is suitable for a wide range of applications, including networks, communication systems, and intelligent scenarios.
The 5AGXMA5D6F27C6G chip model is equipped with a variety of features and design requirements. Its features include low power consumption, high performance, and a wide range of compatibility. In addition, it has a high level of flexibility and scalability, allowing it to be used in various applications. Furthermore, it is designed to be highly reliable and secure, ensuring that data is kept safe and secure.
In order to ensure that the 5AGXMA5D6F27C6G chip model meets the highest standards of performance and reliability, a number of case studies have been conducted. These case studies have examined the performance of the chip model in various applications, as well as its compatibility with different communication systems. Furthermore, a number of precautions have been taken in order to ensure that the chip model remains secure and reliable.
In conclusion, the 5AGXMA5D6F27C6G chip model is a high-performance, low-power integrated circuit designed for use in advanced communication systems. It is capable of being upgraded in the future, allowing it to be applied to more advanced communication systems. Furthermore, it is suitable for a wide range of applications, including networks, communication systems, and intelligent scenarios. The chip model has been designed to meet the highest standards of performance and reliability, and a number of case studies and precautions have been taken in order to ensure that it remains secure and reliable.
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4,505 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,738.2940 | $1,738.2940 |
| 10+ | $1,719.6026 | $17,196.0264 |
| 100+ | $1,626.1460 | $162,614.5971 |
| 1000+ | $1,532.6893 | $766,344.6530 |
| 10000+ | $1,401.8500 | $1,401,849.9750 |
| The price is for reference only, please refer to the actual quotation! | ||