Intel Corporation
5AGXMA5D4F27I3G
5AGXMA5D4F27I3G ECAD Model
5AGXMA5D4F27I3G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.15 V | |
| Number of Inputs | 544 | |
| Number of Outputs | 544 | |
| Number of Logic Cells | 190000 | |
| Number of CLBs | 7170 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 7170 CLBS | |
| Supply Voltage-Max | 1.18 V | |
| Supply Voltage-Min | 1.12 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-672 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
5AGXMA5D4F27I3G Datasheet Download
5AGXMA5D4F27I3G Overview
The chip model 5AGXMA5D4F27I3G is designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is built with the latest HDL language, which is the most efficient and powerful tool for designing and verifying digital systems. This chip model is capable of performing complex operations quickly and accurately, making it ideal for high-performance applications.
The industry trends of the chip model 5AGXMA5D4F27I3G and the future development of related industries will depend on the specific technologies that are needed. For example, if the application environment requires the support of new technologies such as artificial intelligence or machine learning, then the chip model 5AGXMA5D4F27I3G can be upgraded to accommodate these new technologies.
The original design intention of the chip model 5AGXMA5D4F27I3G is to provide a powerful and reliable solution for high-performance digital signal processing, embedded processing, image processing, and other applications. It is capable of performing complex operations quickly and accurately, making it an ideal choice for high-performance applications. Additionally, the chip model 5AGXMA5D4F27I3G can be upgraded to support advanced communication systems, making it a viable solution for the future.
Overall, the chip model 5AGXMA5D4F27I3G is a powerful and reliable solution for high-performance digital signal processing, embedded processing, image processing, and other applications. It is built with the latest HDL language, which allows for complex operations to be performed quickly and accurately. Additionally, the chip model 5AGXMA5D4F27I3G can be upgraded to support advanced communication systems, making it a viable solution for the future. Therefore, the chip model 5AGXMA5D4F27I3G is an ideal choice for those looking for a powerful and reliable solution for their high-performance applications.
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4,903 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,042.4592 | $3,042.4592 |
| 10+ | $3,009.7446 | $30,097.4458 |
| 100+ | $2,846.1715 | $284,617.1505 |
| 1000+ | $2,682.5984 | $1,341,299.2150 |
| 10000+ | $2,453.5961 | $2,453,596.1250 |
| The price is for reference only, please refer to the actual quotation! | ||