Intel Corporation
5AGXMA5D4F27C4G
5AGXMA5D4F27C4G ECAD Model
5AGXMA5D4F27C4G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.1 V | |
| Number of Inputs | 544 | |
| Number of Outputs | 544 | |
| Number of Logic Cells | 190000 | |
| Number of CLBs | 7170 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 7170 CLBS | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-672 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
5AGXMA5D4F27C4G Datasheet Download
5AGXMA5D4F27C4G Overview
The chip model 5AGXMA5D4F27C4G is an advanced semiconductor chip developed by Intel, which is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to use the HDL language, which is a hardware description language that is used to describe the behavior of a digital system.
The 5AGXMA5D4F27C4G is an advanced chip that offers a number of advantages compared to other chips. It has a high processing speed, low power consumption, and a small footprint. It also has a high level of integration, which allows for complex tasks to be performed on a single chip. This makes it ideal for applications such as high-speed digital signal processing, embedded processing, and image processing.
The 5AGXMA5D4F27C4G is expected to be in high demand in the future, as more and more applications require advanced semiconductor chips. This chip is also expected to be used in advanced communication systems, as it has the potential to be upgraded to meet the demands of these systems. The original design intention of the chip was to provide a powerful and reliable solution for applications that require high-performance digital signal processing, embedded processing, and image processing.
The 5AGXMA5D4F27C4G is a versatile chip that can be used for a wide range of applications. It has the potential to be upgraded in the future, as new technologies become available. This makes it an ideal choice for applications that require advanced communication systems. It is also capable of being used for a variety of other applications, such as image processing and embedded processing.
Overall, the 5AGXMA5D4F27C4G is an advanced chip that is suitable for a variety of applications. It has a high processing speed, low power consumption, and a small footprint. It also has a high level of integration, which makes it an ideal choice for applications that require high-performance digital signal processing, embedded processing, and image processing. Furthermore, it has the potential to be upgraded in the future, making it an ideal choice for applications that require advanced communication systems.
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3,438 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,607.8262 | $2,607.8262 |
| 10+ | $2,579.7851 | $25,797.8506 |
| 100+ | $2,439.5794 | $243,957.9354 |
| 1000+ | $2,299.3736 | $1,149,686.8220 |
| 10000+ | $2,103.0857 | $2,103,085.6500 |
| The price is for reference only, please refer to the actual quotation! | ||