Intel Corporation
5AGXMA3D6F31C6G
5AGXMA3D6F31C6G ECAD Model
5AGXMA3D6F31C6G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.1 V | |
| Number of Inputs | 416 | |
| Number of Outputs | 416 | |
| Number of Logic Cells | 156000 | |
| Number of CLBs | 5890 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 5890 CLBS | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-896 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991 |
5AGXMA3D6F31C6G Datasheet Download
5AGXMA3D6F31C6G Overview
The chip model 5AGXMA3D6F31C6G is a cutting-edge technology developed by Intel Corporation. It is a high-end model in the field of computer chips and is widely used in various industries. The chip model is designed to provide a high-performance computing platform for embedded systems, such as industrial control systems and communication systems. The chip model is capable of supporting a variety of advanced technologies, such as AI, machine learning, and cloud computing.
The chip model 5AGXMA3D6F31C6G is designed to provide a reliable and efficient computing platform for embedded systems. It is equipped with a powerful processor, large memory, and a wide range of peripheral devices, making it suitable for a variety of applications. The chip model is also equipped with a variety of advanced features, such as support for multiple operating systems, advanced security features, and high-speed data transfer.
The chip model 5AGXMA3D6F31C6G is expected to have a strong demand in related industries in the future. It is expected that the chip model will be used in a wide range of applications, such as industrial automation, automotive, healthcare, and consumer electronics. The chip model is also expected to be used in advanced communication systems, such as 5G and beyond.
The chip model 5AGXMA3D6F31C6G was designed with the intention of providing a reliable and efficient computing platform for embedded systems. It is designed to be able to support a variety of advanced technologies, such as AI, machine learning, and cloud computing. The chip model is also designed to be upgradable, allowing it to be used in future advanced communication systems.
Overall, the chip model 5AGXMA3D6F31C6G is a powerful and reliable computing platform for embedded systems. It is expected to have a strong demand in related industries in the future, and is also capable of supporting a variety of advanced technologies. The chip model is also designed to be upgradable, making it suitable for use in advanced communication systems.
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5,149 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,654.1264 | $1,654.1264 |
| 10+ | $1,636.3401 | $16,363.4006 |
| 100+ | $1,547.4085 | $154,740.8535 |
| 1000+ | $1,458.4770 | $729,238.5050 |
| 10000+ | $1,333.9729 | $1,333,972.8750 |
| The price is for reference only, please refer to the actual quotation! | ||