Intel Corporation
5AGXMA3D6F27C6G
5AGXMA3D6F27C6G ECAD Model
5AGXMA3D6F27C6G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.1 V | |
| Number of Inputs | 416 | |
| Number of Outputs | 416 | |
| Number of Logic Cells | 156000 | |
| Number of CLBs | 5890 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 5890 CLBS | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-672 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
5AGXMA3D6F27C6G Datasheet Download
5AGXMA3D6F27C6G Overview
The chip model 5AGXMA3D6F27C6G is a new development in the semiconductor industry, offering a wide range of features and capabilities. It is a powerful and versatile chip, designed to meet the needs of modern communication systems. It is capable of supporting a variety of technologies, from high-speed wireless data transfer to advanced signal processing.
The chip model 5AGXMA3D6F27C6G is designed to meet the demands of the modern communication environment. It features a high-speed, low-power design, allowing for efficient operation in a variety of applications. It is also designed to be easily upgradable, allowing for future upgrades and enhancements. The chip model 5AGXMA3D6F27C6G is also designed to be compatible with a wide range of technologies, including those used in advanced communication systems.
In order to ensure that the chip model 5AGXMA3D6F27C6G meets the needs of its users, the product description and design requirements must be carefully considered. This includes the specifications of the chip, such as the number of pins, the power consumption, and the type of memory. It also includes the design of the board, the type of transistors and capacitors used, and the overall architecture of the chip. In addition, the product description should also include information on the actual case studies and precautions that should be taken when using the chip.
The chip model 5AGXMA3D6F27C6G is designed to meet the needs of the modern communication environment. It is a powerful and versatile chip, designed to provide users with the features and capabilities they need. With its high-speed, low-power design, it is capable of supporting a variety of technologies, from high-speed wireless data transfer to advanced signal processing. In addition, its upgradability allows for future upgrades and enhancements, ensuring that it remains relevant in the ever-evolving communication environment. By carefully considering the product description and design requirements, users can ensure that the chip model 5AGXMA3D6F27C6G meets their needs and provides them with the features and capabilities they need.
You May Also Be Interested In
4,241 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,522.4638 | $1,522.4638 |
| 10+ | $1,506.0933 | $15,060.9327 |
| 100+ | $1,424.2404 | $142,424.0373 |
| 1000+ | $1,342.3875 | $671,193.7390 |
| 10000+ | $1,227.7934 | $1,227,793.4250 |
| The price is for reference only, please refer to the actual quotation! | ||