5AGXMA3D4F31I3G
5AGXMA3D4F31I3G
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

5AGXMA3D4F31I3G


5AGXMA3D4F31I3G
F18-5AGXMA3D4F31I3G
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, FBGA-896
FBGA-896

5AGXMA3D4F31I3G ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

5AGXMA3D4F31I3G Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.15 V
Number of Inputs 416
Number of Outputs 416
Number of Logic Cells 156000
Number of CLBs 5890
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 5890 CLBS
Supply Voltage-Max 1.18 V
Supply Voltage-Min 1.12 V
JESD-30 Code S-PBGA-B896
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 896
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Equivalence Code BGA896,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 31 mm
Length 31 mm
Seated Height-Max 2.7 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-896
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991

5AGXMA3D4F31I3G Datasheet Download


5AGXMA3D4F31I3G Overview



The chip model 5AGXMA3D4F31I3G is a state-of-the-art integrated circuit (IC) that integrates multiple functions into one chip. Developed by Intel, this IC is a multi-mode, multi-function device that supports a wide range of applications. It is designed to provide superior performance, reliability and scalability in a variety of markets, from consumer electronics to automotive and aerospace.


The 5AGXMA3D4F31I3G chip is built on a 32nm process technology and is equipped with a high-speed memory controller and an advanced graphics processor. It also features a high-performance multi-core processor, a fast I/O interface and a wide range of communication protocols. This chip is designed to be extremely flexible and can be used in a variety of applications, including embedded systems, mobile phones, and consumer electronics.


The 5AGXMA3D4F31I3G chip is designed to provide superior performance and scalability. It is capable of handling multiple tasks simultaneously, and its high-speed memory controller and advanced graphics processor enable it to provide superior performance in a wide range of applications. In addition, its flexible I/O interface and wide range of communication protocols make it suitable for a variety of communication systems.


The 5AGXMA3D4F31I3G chip is designed to be highly reliable and durable. It is built with a robust architecture and is capable of handling extreme temperatures and harsh conditions. Its advanced power management features ensure that it can operate reliably for extended periods of time. In addition, its advanced security features enable it to protect sensitive data from unauthorized access.


The 5AGXMA3D4F31I3G chip is designed to be highly upgradeable. It is equipped with an advanced software development kit (SDK) that allows developers to easily create custom applications and take advantage of the chip's features. This makes it an ideal choice for applications that require frequent updates and improvements.


The 5AGXMA3D4F31I3G chip is expected to be in high demand in the future, as it is well suited for a variety of applications. Its high performance, scalability, reliability, and upgradeability make it an attractive choice for a wide range of industries. Additionally, its advanced security features make it a great choice for applications that require secure data transfer and storage.


In conclusion, the 5AGXMA3D4F31I3G chip is a state-of-the-art integrated circuit that provides superior performance, scalability, and reliability. Its advanced features and upgradeability make it an ideal choice for a variety of applications, from consumer electronics to automotive and aerospace. Its advanced security features make it a great choice for applications that require secure data transfer and storage. As the demand for this chip increases in the future, it is likely that new technologies will be required to support its application environment.



4,525 In Stock


I want to buy

Unit Price: $713.0848
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $663.1689 $663.1689
10+ $656.0380 $6,560.3802
100+ $620.3838 $62,038.3776
1000+ $584.7295 $292,364.7680
10000+ $534.8136 $534,813.6000
The price is for reference only, please refer to the actual quotation!

Quick Quote