
Intel Corporation
5AGXMA3D4F27I3G
5AGXMA3D4F27I3G ECAD Model
5AGXMA3D4F27I3G Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.15 V | |
Number of Inputs | 416 | |
Number of Outputs | 416 | |
Number of Logic Cells | 156000 | |
Number of CLBs | 5890 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 5890 CLBS | |
Supply Voltage-Max | 1.18 V | |
Supply Voltage-Min | 1.12 V | |
JESD-30 Code | S-PBGA-B672 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Equivalence Code | BGA672,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.7 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-672 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991 |
5AGXMA3D4F27I3G Datasheet Download
5AGXMA3D4F27I3G Overview
The chip model 5AGXMA3D4F27I3G is the latest in a long line of cutting-edge technology. It is an advanced, high-performance, low-power integrated circuit that has been designed to meet the ever-increasing demands of modern communication systems. This chip model features a wide range of features and capabilities, including hardware acceleration, processor-based acceleration, and advanced memory management. It is capable of supporting a wide range of applications, including high-speed data transmission, wireless communication, and multimedia processing.
With the emergence of 5G networks, the demand for high-performance and low-power chips is increasing. The 5AGXMA3D4F27I3G chip is capable of meeting these demands and is an ideal choice for use in 5G networks and other advanced communication systems. It is capable of providing high-speed data transmission, low-power operation, and advanced memory management. This chip is also capable of supporting a wide range of applications, including multimedia processing, wireless communication, and high-speed data transmission.
In addition to its use in 5G networks, the 5AGXMA3D4F27I3G chip is also an excellent choice for use in intelligent scenarios. It is capable of supporting a wide range of applications, including artificial intelligence, machine learning, and deep learning. With the advancement of artificial intelligence and machine learning, the 5AGXMA3D4F27I3G chip is capable of supporting the development of intelligent systems, such as autonomous vehicles, smart homes, and the Internet of Things.
The 5AGXMA3D4F27I3G chip is also capable of being upgraded in the future. Its design allows for future upgrades and modifications, making it an ideal choice for use in the era of fully intelligent systems. With its advanced features and capabilities, the 5AGXMA3D4F27I3G chip is capable of meeting the demands of modern communication systems and providing a wide range of applications in networks and intelligent scenarios.
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5,698 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,664.2997 | $2,664.2997 |
10+ | $2,635.6513 | $26,356.5133 |
100+ | $2,492.4094 | $249,240.9408 |
1000+ | $2,349.1675 | $1,174,583.7440 |
10000+ | $2,148.6288 | $2,148,628.8000 |
The price is for reference only, please refer to the actual quotation! |