5AGXMA3D4F27I3G
5AGXMA3D4F27I3G
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rohs

Intel Corporation

5AGXMA3D4F27I3G


5AGXMA3D4F27I3G
F18-5AGXMA3D4F27I3G
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, FBGA-672
FBGA-672

5AGXMA3D4F27I3G ECAD Model


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5AGXMA3D4F27I3G Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.15 V
Number of Inputs 416
Number of Outputs 416
Number of Logic Cells 156000
Number of CLBs 5890
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 5890 CLBS
Supply Voltage-Max 1.18 V
Supply Voltage-Min 1.12 V
JESD-30 Code S-PBGA-B672
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Equivalence Code BGA672,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.7 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-672
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991

5AGXMA3D4F27I3G Datasheet Download


5AGXMA3D4F27I3G Overview



The chip model 5AGXMA3D4F27I3G is the latest in a long line of cutting-edge technology. It is an advanced, high-performance, low-power integrated circuit that has been designed to meet the ever-increasing demands of modern communication systems. This chip model features a wide range of features and capabilities, including hardware acceleration, processor-based acceleration, and advanced memory management. It is capable of supporting a wide range of applications, including high-speed data transmission, wireless communication, and multimedia processing.


With the emergence of 5G networks, the demand for high-performance and low-power chips is increasing. The 5AGXMA3D4F27I3G chip is capable of meeting these demands and is an ideal choice for use in 5G networks and other advanced communication systems. It is capable of providing high-speed data transmission, low-power operation, and advanced memory management. This chip is also capable of supporting a wide range of applications, including multimedia processing, wireless communication, and high-speed data transmission.


In addition to its use in 5G networks, the 5AGXMA3D4F27I3G chip is also an excellent choice for use in intelligent scenarios. It is capable of supporting a wide range of applications, including artificial intelligence, machine learning, and deep learning. With the advancement of artificial intelligence and machine learning, the 5AGXMA3D4F27I3G chip is capable of supporting the development of intelligent systems, such as autonomous vehicles, smart homes, and the Internet of Things.


The 5AGXMA3D4F27I3G chip is also capable of being upgraded in the future. Its design allows for future upgrades and modifications, making it an ideal choice for use in the era of fully intelligent systems. With its advanced features and capabilities, the 5AGXMA3D4F27I3G chip is capable of meeting the demands of modern communication systems and providing a wide range of applications in networks and intelligent scenarios.



5,698 In Stock


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Unit Price: $2,864.8384
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,664.2997 $2,664.2997
10+ $2,635.6513 $26,356.5133
100+ $2,492.4094 $249,240.9408
1000+ $2,349.1675 $1,174,583.7440
10000+ $2,148.6288 $2,148,628.8000
The price is for reference only, please refer to the actual quotation!

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