Intel Corporation
5AGXMA3D4F27C4G
5AGXMA3D4F27C4G ECAD Model
5AGXMA3D4F27C4G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.1 V | |
| Number of Inputs | 416 | |
| Number of Outputs | 416 | |
| Number of Logic Cells | 156000 | |
| Number of CLBs | 5890 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 5890 CLBS | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-672 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
5AGXMA3D4F27C4G Datasheet Download
5AGXMA3D4F27C4G Overview
The chip model 5AGXMA3D4F27C4G is a highly advanced semiconductor device that is designed to meet the needs of modern networks and intelligent systems. It is a product of the 5th Generation Intel Core processor family, and it is capable of delivering high performance and power efficiency. This chip model is used in a wide range of applications, including mobile computing, gaming, and networked systems.
The 5AGXMA3D4F27C4G chip model is equipped with advanced technologies that enable it to perform efficiently and effectively. It has a low power consumption, which makes it suitable for use in mobile devices and networks. The chip model is also equipped with Intel Hyper-Threading Technology, which allows it to handle multiple threads simultaneously. This makes it highly capable of handling multiple tasks at the same time.
The 5AGXMA3D4F27C4G chip model also provides advanced security features, such as Intel Software Guard Extensions (SGX). This technology enables the chip to protect the data and code stored on it from malicious attacks. The chip model is also equipped with Intel Virtualization Technology (VT-x), which allows it to run multiple operating systems and applications in isolation from each other.
The 5AGXMA3D4F27C4G chip model is expected to be in high demand in the future due to its high performance and power efficiency. It is also expected to be used in a variety of applications, such as autonomous vehicles, robots, and networks. The chip model is also expected to be used in the era of fully intelligent systems, where it may be used to power artificial intelligence and machine learning applications.
The 5AGXMA3D4F27C4G chip model is a powerful and reliable semiconductor device that is capable of meeting the needs of modern networks and intelligent systems. It is equipped with advanced technologies that enable it to perform efficiently and effectively, and it is expected to be in high demand in the future. The chip model is also expected to be used in a variety of applications, including autonomous vehicles, robots, and networks. It is also expected to be used in the era of fully intelligent systems, where it may be used to power artificial intelligence and machine learning applications.
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3,897 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $522.9578 | $522.9578 |
| 10+ | $517.3346 | $5,173.3458 |
| 100+ | $489.2186 | $48,921.8574 |
| 1000+ | $461.1026 | $230,551.2820 |
| 10000+ | $421.7402 | $421,740.1500 |
| The price is for reference only, please refer to the actual quotation! | ||