5AGXFB7K6F40C6N
5AGXFB7K6F40C6N
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Intel Corporation

5AGXFB7K6F40C6N


5AGXFB7K6F40C6N
F18-5AGXFB7K6F40C6N
Active
IC FPGA 704 I/O 1517FBGA
1517-FBGA (40x40)

5AGXFB7K6F40C6N ECAD Model


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5AGXFB7K6F40C6N Attributes


Type Description Select
Mfr Intel
Series Arria V GX
Package Tray
Number of LABs/CLBs 23780
Number of Logic Elements/Cells 504000
Total RAM Bits 27695104
Number of I/O 704
Voltage - Supply 1.07V ~ 1.13V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1517-BBGA
Supplier Device Package 1517-FBGA (40x40)
Base Product Number 5AGXFB7

5AGXFB7K6F40C6N Datasheet Download


5AGXFB7K6F40C6N Overview



The chip model 5AGXFB7K6F40C6N is a high-performance, low-power integrated circuit designed for a variety of applications. It is manufactured by a leading semiconductor company and is used in a wide range of electronics, from smartphones to supercomputers. The chip is designed to provide reliable, energy-efficient performance with minimal power consumption.


The chip model 5AGXFB7K6F40C6N offers several advantages over other chips. It is designed to be more reliable and efficient than traditional chips, and it is also more cost-effective. The chip also has a higher level of integration, allowing for more complex designs. This makes it ideal for applications that require a high level of performance, such as gaming consoles and high-end graphics cards.


In terms of industry trends, the chip model 5AGXFB7K6F40C6N is expected to be in high demand in the near future. This is due to the growing demand for high-performance, low-power integrated circuits. As more applications require advanced features and capabilities, the need for reliable, energy-efficient chips will continue to increase. This will provide a great opportunity for the chip model 5AGXFB7K6F40C6N to gain market share.


The product description of the chip model 5AGXFB7K6F40C6N includes a number of features and specifications. It is designed to offer a high level of performance and reliability, as well as low power consumption. The chip also has a high level of integration, allowing for more complex designs. It is also designed to be compatible with a wide range of operating systems, including Windows, Mac, and Linux.


In terms of design requirements, the chip model 5AGXFB7K6F40C6N requires certain components and connections to be present in order to function properly. This includes the presence of a power supply, memory, and other components. Additionally, the chip must be able to communicate with other components, such as a processor and a graphics card. The chip must also be able to handle the data transfer rates required for the application.


In terms of actual case studies, the chip model 5AGXFB7K6F40C6N has been used in a variety of applications, including gaming consoles, high-end graphics cards, and other consumer electronics. It has been proven to be reliable and efficient in these applications, and it has also been successful in reducing power consumption.


Finally, there are some precautions to consider when using the chip model 5AGXFB7K6F40C6N. It is important to ensure that the chip is properly installed and connected to the other components. Additionally, it is important to ensure that the chip is compatible with the operating system and other components. Finally, it is important to ensure that the chip is not exposed to extreme temperatures or other environmental conditions that could damage it.


In conclusion, the chip model 5AGXFB7K6F40C6N is a high-performance, low-power integrated circuit designed for a variety of applications. It offers several advantages over other chips, including higher levels of integration, reliability, and energy efficiency. The chip is expected to be in high demand in the near future, due to the increasing demand for high-performance, low-power integrated circuits. The product description, design requirements, and actual case studies of the chip model 5AGXFB7K6F40C6N should be carefully considered when determining if the application environment requires the support of new technologies.



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