
Intel Corporation
5AGXFB7H4F35C4G
5AGXFB7H4F35C4G ECAD Model
5AGXFB7H4F35C4G Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.1 V | |
Number of Inputs | 704 | |
Number of Outputs | 704 | |
Number of Logic Cells | 504000 | |
Number of CLBs | 19024 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 19024 CLBS | |
Supply Voltage-Max | 1.13 V | |
Supply Voltage-Min | 1.07 V | |
JESD-30 Code | S-PBGA-B1152 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 2.7 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
5AGXFB7H4F35C4G Datasheet Download
5AGXFB7H4F35C4G Overview
The chip model 5AGXFB7H4F35C4G has become increasingly popular in recent years due to its impressive performance and versatility. This chip model is suitable for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language for programming.
The 5AGXFB7H4F35C4G chip model has several advantages over competing models. It has a high-speed parallel architecture that supports multiple cores, allowing for faster processing speeds. Additionally, it has a low power consumption, which makes it ideal for applications that require low power consumption. Furthermore, its integrated memory controller allows for faster memory access and improved memory bandwidth.
The 5AGXFB7H4F35C4G chip model is expected to remain popular in the future due to its impressive performance and versatility. Its high-speed parallel architecture and low power consumption make it an ideal choice for a wide range of applications. Furthermore, its integrated memory controller allows for improved memory bandwidth and faster memory access.
In terms of future trends, the 5AGXFB7H4F35C4G chip model is expected to remain popular in related industries. It is likely that the model will continue to be used in applications that require high-performance digital signal processing, embedded processing, and image processing. Additionally, it is likely that new technologies will be required to support the application environment, such as artificial intelligence and machine learning.
Overall, the 5AGXFB7H4F35C4G chip model is an impressive model with a variety of advantages. Its high-speed parallel architecture, low power consumption, and integrated memory controller make it an ideal choice for a wide range of applications. Additionally, its future trends in related industries are likely to remain strong, and it is likely that new technologies will be required to support the application environment.
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4,832 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,179.1186 | $2,179.1186 |
10+ | $2,155.6872 | $21,556.8724 |
100+ | $2,038.5303 | $203,853.0321 |
1000+ | $1,921.3734 | $960,686.7030 |
10000+ | $1,757.3537 | $1,757,353.7250 |
The price is for reference only, please refer to the actual quotation! |