Intel Corporation
5AGXFB5H4F35I3G
5AGXFB5H4F35I3G ECAD Model
5AGXFB5H4F35I3G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.15 V | |
| Number of Inputs | 704 | |
| Number of Outputs | 704 | |
| Number of Logic Cells | 420000 | |
| Number of CLBs | 15849 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 15849 CLBS | |
| Supply Voltage-Max | 1.18 V | |
| Supply Voltage-Min | 1.12 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
5AGXFB5H4F35I3G Datasheet Download
5AGXFB5H4F35I3G Overview
The chip model 5AGXFB5H4F35I3G is an advanced microchip designed for high-performance digital signal processing, embedded processing, and image processing. It is based on the latest in high-speed, low-power technology and is programmed using HDL language. This makes it suitable for a variety of applications, from high-end digital signal processing to embedded systems and image processing.
The chip model 5AGXFB5H4F35I3G is well-suited for the current trend of miniaturization and power efficiency in the industry. It is capable of performing complex computations in a fraction of the time and energy of traditional chips. This makes it a great choice for applications that require both speed and accuracy.
The chip model 5AGXFB5H4F35I3G is also well-suited for the future of intelligent networks and systems. It has the potential to be used in a variety of intelligent scenarios, from autonomous vehicles to smart home systems. It is also capable of handling complex computations, which makes it a great choice for the era of fully intelligent systems.
In terms of new technologies, the chip model 5AGXFB5H4F35I3G is capable of supporting a variety of new technologies. This includes technologies such as Machine Learning and Deep Learning, which can be used to create more efficient and powerful systems. Additionally, the chip model 5AGXFB5H4F35I3G can also be used to support new communication protocols, such as 5G and Wi-Fi 6.
Overall, the chip model 5AGXFB5H4F35I3G is a great choice for high-performance digital signal processing, embedded processing, and image processing. It is capable of supporting a variety of new technologies and can be used in a variety of intelligent scenarios. With its low-power, high-speed technology, it is well-suited for the current trend of miniaturization and power efficiency in the industry. It is also capable of handling complex computations, making it a great choice for the era of fully intelligent systems.
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2,321 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,239.6340 | $2,239.6340 |
| 10+ | $2,215.5519 | $22,155.5191 |
| 100+ | $2,095.1415 | $209,514.1482 |
| 1000+ | $1,974.7311 | $987,365.5260 |
| 10000+ | $1,806.1565 | $1,806,156.4500 |
| The price is for reference only, please refer to the actual quotation! | ||