5AGXFB3H4F35C4N
5AGXFB3H4F35C4N
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Intel Corporation

5AGXFB3H4F35C4N


5AGXFB3H4F35C4N
F18-5AGXFB3H4F35C4N
Active
IC FPGA 544 I/O 1152FBGA
1152-FBGA (35x35)

5AGXFB3H4F35C4N ECAD Model


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5AGXFB3H4F35C4N Attributes


Type Description Select
Mfr Intel
Series Arria V GX
Package Tray
Number of LABs/CLBs 17110
Number of Logic Elements/Cells 362000
Total RAM Bits 19822592
Number of I/O 544
Voltage - Supply 1.07V ~ 1.13V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1152-BBGA, FCBGA Exposed Pad
Supplier Device Package 1152-FBGA (35x35)
Base Product Number 5AGXFB3

5AGXFB3H4F35C4N Datasheet Download


5AGXFB3H4F35C4N Overview



The 5AGXFB3H4F35C4N chip is an Intel Stratix 10 FPGA. It is a high-performance, low-power FPGA with a high-speed transceiver, high-density memory, and advanced power management capabilities. It is designed to meet the needs of high-performance, low-power applications.


The 5AGXFB3H4F35C4N chip has a transceiver data rate of up to 28.05 Gbps and a transceiver power consumption of up to 1.5 W. It has a total logic capacity of up to 3.5 million logic elements and up to 8.5 million memory bits. It also has up to 8.5 million embedded memory bits, up to 32 PLLs, and up to 8 GXB transceivers.


The 5AGXFB3H4F35C4N chip is suitable for a wide range of applications including high-speed networking, high-performance computing, video and image processing, machine learning, and artificial intelligence. It is also suitable for automotive, industrial and consumer applications.


The chip is available in a variety of packages, including a BGA, FBGA, and QFN package. It is also available in a wide range of temperature ranges, from -40°C to +85°C.


The 5AGXFB3H4F35C4N chip is an ideal solution for high-performance, low-power applications. It is designed to provide high performance, low power consumption, and advanced power management capabilities. It is a reliable and cost-effective solution for a wide variety of applications.



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