
Intel Corporation
5AGXFB1H6F35C6N
5AGXFB1H6F35C6N ECAD Model
5AGXFB1H6F35C6N Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Arria V GX | |
Package | Tray | |
Number of LABs/CLBs | 14151 | |
Number of Logic Elements/Cells | 300000 | |
Total RAM Bits | 17358848 | |
Number of I/O | 544 | |
Voltage - Supply | 1.07V ~ 1.13V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 1152-BBGA, FCBGA Exposed Pad | |
Supplier Device Package | 1152-FBGA (35x35) | |
Base Product Number | 5AGXFB1 |
5AGXFB1H6F35C6N Datasheet Download
5AGXFB1H6F35C6N Overview
The 5AGXFB1H6F35C6N chip model is a high-performance Field Programmable Gate Array (FPGA) manufactured by Intel. It is a member of the Stratix 10 family of FPGAs, which are based on the Intel Hyperflex FPGA architecture.
The 5AGXFB1H6F35C6N is a high-end, high-density FPGA with a total of 1.35 million logic elements and up to 10,240 18-bit embedded multipliers. It offers up to 1.5 TFLOPS of floating-point performance and up to 2.5 TFLOPS of fixed-point performance. It also features up to 1.5 TB of on-chip memory, up to 4.5 TB of off-chip memory, and up to 24.8 Gbps of transceiver bandwidth.
The 5AGXFB1H6F35C6N is ideal for applications requiring high-performance computing, such as data analytics, machine learning, artificial intelligence, and video processing. It is also suitable for applications requiring high-speed communication, such as 5G and edge computing. It is also suitable for applications requiring high-density memory, such as image processing, video encoding, and data storage.
In addition, the 5AGXFB1H6F35C6N is designed to be power efficient, with an operating voltage of 0.8V to 1.2V and a power consumption of up to 90W. It also features a wide range of I/O and connectivity options, including PCIe, Ethernet, USB, and more.
Overall, the 5AGXFB1H6F35C6N is a high-performance, high-density FPGA that is suitable for a wide range of applications requiring high-performance computing, high-speed communication, and high-density memory.
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