Intel Corporation
5AGXFB1H4F40I3G
5AGXFB1H4F40I3G ECAD Model
5AGXFB1H4F40I3G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.15 V | |
| Number of Inputs | 704 | |
| Number of Outputs | 704 | |
| Number of Logic Cells | 300000 | |
| Number of CLBs | 11321 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11321 CLBS | |
| Supply Voltage-Max | 1.18 V | |
| Supply Voltage-Min | 1.12 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1517 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
5AGXFB1H4F40I3G Datasheet Download
5AGXFB1H4F40I3G Overview
The chip model 5AGXFB1H4F40I3G is a powerful device that is designed to meet the needs of advanced communication systems. It is an advanced device that is capable of providing reliable and high-performance data transfer and communication services. It is also capable of supporting a wide range of applications, including high-speed data transfer, low latency communication, and secure data transmission.
The 5AGXFB1H4F40I3G chip model is designed to be highly reliable and efficient. It is capable of providing high-speed and low-latency data transfer and communication services. It is also capable of supporting a wide range of applications, including high-speed data transfer, low latency communication, and secure data transmission.
The chip model 5AGXFB1H4F40I3G is designed to be highly reliable and efficient. It is capable of providing reliable and high-performance data transfer and communication services. It is also capable of supporting a wide range of applications, including high-speed data transfer, low latency communication, and secure data transmission.
The chip model 5AGXFB1H4F40I3G is designed to be highly reliable and efficient. It is capable of providing reliable and high-performance data transfer and communication services. It is also designed to be upgradable and capable of supporting new technologies as the application environment requires. It is also designed to meet the specific design requirements of the customer.
The chip model 5AGXFB1H4F40I3G is designed to meet the needs of advanced communication systems. It is capable of providing reliable and high-performance data transfer and communication services. It is also capable of supporting a wide range of applications, including high-speed data transfer, low latency communication, and secure data transmission.
In terms of industry trends, the chip model 5AGXFB1H4F40I3G is highly sought after due to its advanced features and capabilities. It is a key component in the development of advanced communication systems and the development of related industries. It is also capable of being upgraded to meet the needs of more advanced applications.
Case studies and customer feedback have been used to analyze the chip model 5AGXFB1H4F40I3G and its performance. This has enabled the chip model to be further optimized and improved. It is also important to note that the chip model is designed to be highly reliable and efficient. Therefore, it is important to ensure that the chip model is used in an appropriate environment and the necessary precautions are taken to ensure its proper functioning.
In conclusion, the chip model 5AGXFB1H4F40I3G is a powerful device that is designed to meet the needs of advanced communication systems. It is capable of providing reliable and high-performance data transfer and communication services. It is also capable of being upgraded to meet the needs of more advanced applications. Furthermore, it is important to ensure that the chip model is used in an appropriate environment and the necessary precautions are taken to ensure its proper functioning.
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5,619 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $7,140.9552 | $7,140.9552 |
| 10+ | $7,064.1708 | $70,641.7078 |
| 100+ | $6,680.2485 | $668,024.8455 |
| 1000+ | $6,296.3261 | $3,148,163.0650 |
| 10000+ | $5,758.8349 | $5,758,834.8750 |
| The price is for reference only, please refer to the actual quotation! | ||