Intel Corporation
5AGXFA7H4F35I5G
5AGXFA7H4F35I5G ECAD Model
5AGXFA7H4F35I5G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.1 V | |
| Number of Inputs | 544 | |
| Number of Outputs | 544 | |
| Number of Logic Cells | 242000 | |
| Number of CLBs | 9168 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 9168 CLBS | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
5AGXFA7H4F35I5G Datasheet Download
5AGXFA7H4F35I5G Overview
The chip model 5AGXFA7H4F35I5G is a new and innovative technology developed by the semiconductor industry. It is a modern, low-power, high-performance chip model that is designed to meet the needs of the current and future communication systems.
The 5AGXFA7H4F35I5G chip model is designed to provide a high-speed, low-power, and reliable communication system. It is designed with a high-performance, low-power architecture, and is capable of supporting high-speed data transmission, low latency, and low power consumption. The chip model is also designed to be compatible with the latest communication protocols, such as the IEEE 802.11ac standard.
The 5AGXFA7H4F35I5G chip model is designed to support a variety of applications, including wireless communication, video streaming, and data storage. It is also designed to be compatible with a wide range of communication protocols, such as Bluetooth, ZigBee, and Wi-Fi. The chip model is also designed to be highly reliable, with advanced error correction and security features.
The 5AGXFA7H4F35I5G chip model is designed to be highly scalable and flexible. It can be used in a wide range of applications, from low-power, small-scale systems to large-scale, high-performance systems. The chip model is also designed to be upgradeable, allowing for future upgrades and improvements.
The 5AGXFA7H4F35I5G chip model is designed to be highly reliable and secure. It is designed with advanced error correction and security features, and is designed to be compatible with a wide range of communication protocols. The chip model is also designed to be highly efficient, with low power consumption and low latency.
The 5AGXFA7H4F35I5G chip model is designed to be highly reliable and secure. It is designed with advanced error correction and security features, and is designed to be compatible with a wide range of communication protocols. The chip model is also designed to be highly efficient, with low power consumption and low latency.
The 5AGXFA7H4F35I5G chip model is designed to be highly reliable and secure. It is designed with advanced error correction and security features, and is designed to be compatible with a wide range of communication protocols. The chip model is also designed to be highly efficient, with low power consumption and low latency.
In terms of industry trends, the 5AGXFA7H4F35I5G chip model is designed to meet the needs of the current and future communication systems. It is designed to be highly reliable and secure, and is designed to be compatible with a wide range of communication protocols. The chip model is also designed to be highly efficient, with low power consumption and low latency.
In terms of future development, the 5AGXFA7H4F35I5G chip model is designed to be upgradeable, allowing for future upgrades and improvements. It is also designed to be highly flexible and scalable, allowing for a variety of applications, from low-power, small-scale systems to large-scale, high-performance systems.
In terms of application environment, the 5AGXFA7H4F35I5G chip model is designed to be compatible with a wide range of communication protocols, such as Bluetooth, ZigBee, and Wi-Fi. It is also designed to be highly reliable and secure, with advanced error correction and security features.
Finally, in terms of product description and design requirements, the 5AGXFA7H4F35I5G chip model is designed to provide a high-speed, low-power, and reliable communication system. It is designed with a high-performance, low-power architecture, and is capable of supporting high-speed data transmission, low latency, and low power consumption. Finally, actual case studies and precautions should be taken into consideration when using the 5AGXFA7H4F35I5G chip model.
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3,852 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,740.5896 | $4,740.5896 |
| 10+ | $4,689.6155 | $46,896.1554 |
| 100+ | $4,434.7451 | $443,474.5134 |
| 1000+ | $4,179.8747 | $2,089,937.3620 |
| 10000+ | $3,823.0562 | $3,823,056.1500 |
| The price is for reference only, please refer to the actual quotation! | ||