Intel Corporation
5AGXBB7D4F40C5G
5AGXBB7D4F40C5G ECAD Model
5AGXBB7D4F40C5G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.1 V | |
| Number of Inputs | 704 | |
| Number of Outputs | 704 | |
| Number of Logic Cells | 504000 | |
| Number of CLBs | 19024 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 19024 CLBS | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1517 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
5AGXBB7D4F40C5G Datasheet Download
5AGXBB7D4F40C5G Overview
The 5AGXBB7D4F40C5G chip model is a new and innovative technology developed by a leading semiconductor company. It has been designed to offer a wide range of advantages, including low power consumption, high performance, and reliability. This makes it an ideal choice for the industries that require such advanced technology.
The chip model 5AGXBB7D4F40C5G is expected to be in high demand in the future. Its power-saving features and high-performance capabilities make it an ideal choice for industries that require advanced technology, such as the automotive, medical, and aerospace industries. Additionally, its low power consumption makes it an attractive option for energy-saving applications.
The original design intention of the 5AGXBB7D4F40C5G chip model was to provide a reliable and high-performance solution for a wide range of applications. It has been designed to offer a wide range of features, including low power consumption, high performance, and reliability. Additionally, the chip can be upgraded in the future to provide additional features, such as improved security and advanced communication systems.
The 5AGXBB7D4F40C5G chip model has the potential to be applied to a wide range of applications in networks and intelligent scenarios. It can be used in the era of fully intelligent systems, as it has the capability to perform complex calculations and tasks. Additionally, it can be used in a wide range of communication systems, such as 5G networks, Wi-Fi, and Bluetooth.
In conclusion, the 5AGXBB7D4F40C5G chip model is an advanced technology that offers a wide range of advantages, including low power consumption, high performance, and reliability. It is expected to be in high demand in the future due to its power-saving features and high-performance capabilities. Additionally, it can be upgraded in the future to provide additional features, such as improved security and advanced communication systems. Furthermore, it has the potential to be applied to a wide range of applications in networks and intelligent scenarios, making it an ideal choice for the industries that require such advanced technology.
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4,823 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,586.1481 | $1,586.1481 |
| 10+ | $1,569.0928 | $15,690.9275 |
| 100+ | $1,483.8160 | $148,381.5972 |
| 1000+ | $1,398.5392 | $699,269.5960 |
| 10000+ | $1,279.1517 | $1,279,151.7000 |
| The price is for reference only, please refer to the actual quotation! | ||